LFE3-150EA-8FN672I

The LFE3-150EA-8FN672I is an ECP3 family field programmable gate array (FPGA) from Lattice Semiconductor Corporation. It offers a high density of programmable logic with 149,000 logic elements and a large amount of embedded memory, packaged in a 672-ball BGA suitable for surface-mount assembly.

Designed for industrial-grade applications, this device provides a broad I/O complement and a defined operating range, making it appropriate for systems that require substantial logic resources, significant on-chip RAM, and reliable operation across industrial temperature conditions.

Key Features

• Programmable Logic Capacity 149,000 logic elements provide extensive resource headroom for complex custom logic and hardware acceleration.
• Configurable Logic Blocks (CLBs) 18,625 CLBs enable structured implementation of combinational and sequential logic throughout the device.
• Embedded Memory Approximately 7.01 Mbits of on-chip RAM (7,014,400 total RAM bits) to support buffering, packet processing, and local data storage without external memory.
• I/O Density 380 general-purpose I/O pins accommodate high-channel-count interfacing and flexible board-level integration.
• Package and Mounting 672-BBGA (supplier package: 672-FPBGA, 27×27) in a surface-mount form factor for compact, high-density PCB layouts.
• Power Supply Operates from a core supply range of 1.14 V to 1.26 V to match system power-rail planning and design constraints.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet extended temperature requirements typical of industrial systems.
• RoHS Compliance RoHS-compliant construction supports environmental and regulatory requirements for many markets.

Typical Applications

• Industrial Control & Automation — Industrial-grade qualification and a wide operating temperature range support custom control logic, I/O aggregation, and interface bridging in factory or process environments.
• High-Density I/O Systems — With 380 I/Os and a compact 672-BBGA package, the device suits designs that require many signal interfaces in constrained PCB area.
• Embedded Acceleration & Processing — Large logic capacity and approximately 7.01 Mbits of embedded memory enable implementation of custom hardware accelerators and on-chip buffering for deterministic performance.

Unique Advantages

• Large Logic Resource Pool: 149,000 logic elements give designers ample capacity for complex, multi-function designs without immediate need for external programmable logic.
• Significant On-Chip Memory: Approximately 7.01 Mbits of embedded RAM reduces dependence on external memories and simplifies board-level BOM and routing.
• High I/O Count in a Compact Package: 380 I/Os in a 672-ball BGA enable dense connectivity while keeping board footprint small.
• Industrial-Grade Reliability: Specified for −40 °C to 100 °C operation and RoHS compliance to align with industrial deployment requirements.
• Surface-Mount 672-BBGA: The 27×27 672-FPBGA supplier package supports standard SMT assembly for volume production.

Why Choose LFE3-150EA-8FN672I?

The LFE3-150EA-8FN672I positions itself as a high-capacity, industrial-grade FPGA option with a balance of logic density, embedded memory, and high I/O count in a compact surface-mount 672-BBGA package. Its specified core voltage range and extended temperature rating make it suitable for robust designs that need predictable, on-chip resources.

Engineers and procurement teams targeting designs that require substantial programmable logic, significant on-chip RAM, and broad I/O connectivity will find this FPGA appropriate for scalable, long-term deployments where environmental range and RoHS compliance are important considerations.

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