LFE3-150EA-8FN1156C

The LFE3-150EA-8FN1156C is an ECP3 family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation supplied in a 1156-BBGA package. This commercial-grade FPGA delivers high logic density, substantial embedded memory, and a large number of I/O pins for designs that require programmable logic in a surface-mount form factor.

Key on-chip resources include approximately 149,000 logic elements and approximately 7.0 Mbits of embedded memory, while the device operates within a 1.14 V to 1.26 V supply range and a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core Logic Approximately 149,000 logic elements to implement complex programmable logic and custom processing functions.
• Embedded Memory Approximately 7.0 Mbits of on-chip RAM for buffering, frame storage, and intermediate data processing.
• High I/O Count 586 user I/O pins to support dense interface requirements and multiple high-pin-count peripherals.
• Package 1156-BBGA package; supplier device package noted as 1156-FPBGA (35×35) for compact, high-density board integration.
• Power Supply Core supply range of 1.14 V to 1.26 V to align with system power rails and design constraints.
• Mounting & Grade Surface mount device with commercial temperature grading (0 °C to 85 °C) suitable for standard commercial applications.
• Regulatory Compliance RoHS compliant.

Typical Applications

• Communications and Networking Use the high logic density and 586 I/Os to implement protocol bridging, packet processing, and interface aggregation.
• Video and Imaging Systems On-chip memory and extensive logic resources support buffering, format conversion, and parallel pixel processing.
• Test and Measurement Equipment Programmable logic and large I/O count enable custom front-end interfacing, signal conditioning control, and data capture.
• Prototyping and Custom Logic Leverage the ECP3 FPGA architecture for hardware acceleration, custom IP validation, and board-level prototyping.

Unique Advantages

• High Logic Density: Approximately 149,000 logic elements allow consolidation of multiple functions into a single device, reducing board-level component count.
• Substantial Embedded Memory: Approximately 7.0 Mbits of on-chip RAM supports larger FIFOs, frame buffers, and local data storage without external memory.
• Extensive I/O Resources: 586 I/O pins accommodate multiple parallel interfaces and high-pin-count peripherals without additional multiplexing hardware.
• Compact, High-Density Package: 1156-BBGA (1156-FPBGA, 35×35) provides a compact footprint for high-pin-count integration on space-constrained PCBs.
• Commercial-Grade Operation: Rated for 0 °C to 85 °C operation to meet standard commercial deployment environments.
• RoHS Compliant: Designed to meet common environmental compliance expectations for commercial electronics.

Why Choose LFE3-150EA-8FN1156C?

The LFE3-150EA-8FN1156C positions itself as a high-capacity, commercially graded FPGA option within the ECP3 family, combining large logic resources, multi-megabit embedded RAM, and a very high I/O count in a 1156-BBGA package. It is well suited for designers who need to consolidate complex logic, handle substantial on-chip data, and interface with many external signals in commercial applications.

For teams focused on scalable programmable logic solutions and compact board-level integration, this device provides a balance of density, on-chip memory, and I/O that supports a range of communications, imaging, test, and prototyping use cases. Manufacturer documentation is available for detailed implementation and design guidance.

If you would like pricing or availability information, request a quote or submit an inquiry to receive a formal quotation and lead-time details for the LFE3-150EA-8FN1156C.