LFE3-150EA-7LFN1156C

The LFE3-150EA-7LFN1156C is a commercial-grade FPGA from Lattice Semiconductor’s ECP3 family. It delivers a high-density reconfigurable fabric with 149,000 logic elements and extensive I/O to support high-performance, integration-focused designs.

Built on the ECP3 architecture and 65 nm technology (LatticeECP3 family), this device targets applications that require large logic capacity, multi-gigabit SERDES and flexible memory and DSP resources while maintaining a surface-mount BBGA package and RoHS compliance.

Key Features

• Logic Capacity — 149,000 logic elements provide substantial integration for complex FPGA designs and large-scale glue logic.
• On‑Chip Memory — Total RAM of 7,014,400 bits (approximately 7.01 Mbits) for embedded block RAM and distributed RAM storage.
• I/O Density — 586 user I/Os support extensive external connectivity and parallel interfaces.
• High‑Speed SERDES — Family-level SERDES capability described in the ECP3 datasheet with multi‑hundreds of Mbps to multi‑Gbps channel support for serial protocols and high-speed links.
• sysDSP Slices — Enhanced DSP resources in the ECP3 family including cascaded slices and high‑precision multiply/accumulate functionality for signal processing tasks.
• Clocking — Device-level support for multiple PLLs and DLLs as defined for the ECP3 family, enabling flexible clock management for complex systems.
• Configuration & Reliability — Supports flexible configuration options described for the ECP3 family, including SPI boot flash interface, dual‑boot images and soft error detection macros.
• Package & Power — 1156‑BBGA surface mount package (supplier package: 1156‑FPBGA, 35 × 35 mm); nominal core supply range 1.14 V to 1.26 V.
• Operating Range & Compliance — Commercial grade operation from 0 °C to 85 °C; RoHS compliant.

Typical Applications

• High‑speed communications — Implement multi‑Gbps serial links and protocol bridging using the ECP3 family SERDES and abundant I/O resources.
• Video and broadcast systems — Leverage the device’s DSP slices and memory to implement video processing pipelines and standards-based interfaces.
• Industrial and instrumentation — Use large logic capacity and flexible I/O for sensor aggregation, data‑acquisition front ends and protocol conversion (commercial-grade temperature range applies).
• Embedded system integration — Consolidate glue logic, protocol bridging and peripheral control in a single FPGA with ample LUTs and embedded RAM.

Unique Advantages

• High integration density: 149,000 logic elements enable consolidation of multiple functions into one device, reducing BOM and board area.
• Substantial on‑chip memory: Approximately 7.01 Mbits of total RAM supports large buffers, FIFOs and on‑chip data storage for high-throughput designs.
• Extensive I/O count: 586 user I/Os allow broad interfacing options without external multiplexing or additional I/O expanders.
• Flexible configuration options: Supports SPI boot, dual‑boot images and on‑chip configuration features that simplify field updates and deployment.
• Commercial temperature and RoHS compliance: Designed for mainstream electronic products and compliant with RoHS requirements for regulatory alignment.

Why Choose LFE3-150EA-7LFN1156C?

The LFE3-150EA-7LFN1156C provides a high-capacity, configurable fabric from the LatticeECP3 family suited for designs that demand significant logic density, memory and I/O in a surface-mount BBGA package. Its combination of 149,000 logic elements, approximately 7.01 Mbits of on‑chip RAM and up to 586 I/Os makes it a practical choice for systems requiring integration of DSP, interface bridging and high-speed serial links within the commercial temperature range.

As part of the LatticeECP3 family, the device benefits from the family-level features documented in the ECP3 data material—such as advanced DSP slices, configurable SERDES capability, clock management and flexible configuration options—providing scalability and design continuity across related devices.

Request a quote or submit a procurement inquiry for pricing and availability of LFE3-150EA-7LFN1156C to move your design forward.