LFE3-150EA-7FN1156I

The LFE3-150EA-7FN1156I is a Lattice Semiconductor ECP3 family FPGA delivered in a 1156-BBGA (35 × 35 mm) surface-mount package. It provides a high-density, reconfigurable logic fabric suitable for designs requiring large I/O counts, abundant on-chip RAM, and embedded SERDES and DSP resources.

This device targets applications in communications, video/broadcast, and high‑performance embedded systems where integration, flexibility, and industrial temperature operation are important design drivers.

Key Features

• Core Logic  Approximately 149,000 logic elements implemented across 18,625 LABs, enabling complex combinatorial and sequential logic integration.
• Embedded Memory  Total on-chip RAM of 7,014,400 bits (approximately 7.01 Mbits) for large buffering and state storage requirements.
• DSP Resources  Up to 320 18 × 18 multipliers and a sysDSP architecture for multiply-accumulate and high-performance arithmetic operations.
• High-Speed SERDES  Embedded SERDES supporting data rates from 150 Mbps to 3.2 Gbps per channel, with support for up to 16 channels per device and common protocols such as PCI Express, SONET/SDH, Ethernet (1GbE, SGMII, XAUI), CPRI, SMPTE 3G, and Serial RapidIO.
• I/O Flexibility  Up to 586 user I/Os with programmable sysI/O buffer options and support for a wide range of single‑ended and differential standards.
• Clocking and Timing  Multiple PLLs and DLLs on-chip to support complex clocking domains and source synchronous interfaces (family data indicates up to 10 PLLs and 2 DLLs).
• Configuration and System Support  Flexible configuration options including dedicated configuration I/O and SPI boot flash interface (family-level features).
• Power and Temperature  Core supply specified at 1.14 V to 1.26 V; industrial operating temperature range from −40 °C to 100 °C.
• Package and Mounting  1156-BBGA surface-mount package (supplier package: 1156-FPBGA, 35 × 35 mm) for compact, high-pin-count system designs.
• RoHS Compliant  Manufactured in compliance with RoHS requirements.

Typical Applications

• High‑speed Communications  Protocol bridging, aggregation, and serializer/deserializer tasks leveraging up to 16 SERDES channels and high I/O density.
• Video and Broadcast Systems  Support for SMPTE 3G and high-bandwidth interfaces with large embedded memory for frame buffering and processing.
• Industrial Networking and Infrastructure  Complex packet processing, timing, and interface conversion in industrial temperature environments.
• Embedded Signal Processing  DSP slices and extensive multiplier resources for MAC-heavy algorithms and real‑time data processing.

Unique Advantages

• High Logic Density:  Approximately 149,000 logic elements enable consolidation of multiple functions into a single device, reducing BOM and board complexity.
• Large On‑Chip Memory:  Approximately 7.01 Mbits of embedded RAM supports substantial buffering and stateful processing without external memory.
• Extensive I/O and SERDES:  586 user I/Os combined with multi‑Gbps SERDES channels let you connect a broad set of high-speed peripherals and links directly to the FPGA.
• Industrial Temperature Range:  Rated for −40 °C to 100 °C operation for deployment in industrial environments.
• Flexible Clocking and DSP:  Multiple PLLs/DLLs and a robust sysDSP architecture support complex timing and high-performance arithmetic tasks.
• Compact, High‑Pin Package:  1156‑pin BBGA (35 × 35 mm) package provides high integration density for space-constrained systems.

Why Choose LFE3-150EA-7FN1156I?

The LFE3-150EA-7FN1156I delivers a combination of high logic capacity, large embedded memory, abundant I/O, and multi‑Gbps SERDES capability in a single industrial‑grade FPGA. It is well suited to designers who need to integrate complex interfaces, on‑chip processing, and substantial buffering while maintaining a compact board footprint.

This device is aimed at system architects and engineers building communications, broadcast, and industrial embedded systems where long-term availability, a mature feature set, and flexible configuration options are important design considerations.

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