LFE3-150EA-6LFN672C

IC FPGA 380 I/O 672FPBGA
Part Description

ECP3 Field Programmable Gate Array (FPGA) IC 380 7014400 149000 672-BBGA

Quantity 143 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package672-FPBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O380Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs18625Number of Logic Elements/Cells149000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits7014400

Overview of LFE3-150EA-6LFN672C – ECP3 Field Programmable Gate Array, 149,000 logic elements, 672‑BBGA

The LFE3-150EA-6LFN672C is an ECP3 family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It delivers high logic capacity and on-chip memory in a compact 672‑ball BGA package for surface-mount PCB assembly.

This device integrates 149,000 logic elements, approximately 7.01 Mbits of embedded memory, and up to 380 I/O pins, operating from a 1.14 V to 1.26 V supply and rated for commercial temperature use (0 °C to 85 °C).

Key Features

  • Core & Architecture  ECP3 family FPGA architecture packaged as a 672‑BBGA (supplier package: 672‑FPBGA, 27×27).
  • Logic Capacity  149,000 logic elements and 18,625 internal logic blocks provide substantial programmable resources for complex logic implementations.
  • Embedded Memory  Approximately 7.01 Mbits of on-chip RAM to support data buffering, packet handling, and state storage.
  • I/O  Up to 380 general-purpose I/O pins to interface with external peripherals and high‑pin‑count systems.
  • Power  Low-voltage core operation with a supply range of 1.14 V to 1.26 V.
  • Package & Mounting  672‑ball BGA package designed for surface-mount PCB assembly; compact 27×27 supplier package footprint.
  • Temperature & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
  • Environmental Compliance  RoHS compliant.

Unique Advantages

  • High programmable density: 149,000 logic elements enable integration of large digital functions without external ASICs or multiple discrete components.
  • Substantial on-chip memory: Approximately 7.01 Mbits of embedded RAM reduces external memory requirements and simplifies board routing.
  • Generous I/O count: Up to 380 I/O pins support complex interfacing and multiple peripheral connections from a single device.
  • Compact board footprint: 672‑BBGA (27×27) package provides a high‑density solution for space-constrained applications.
  • Low-voltage core operation: 1.14 V to 1.26 V supply range supports power-sensitive designs and modern power-rail architectures.
  • RoHS compliant: Meets common environmental requirements for lead‑free assemblies.

Why Choose LFE3-150EA-6LFN672C?

The LFE3-150EA-6LFN672C positions itself as a high‑capacity, commercially graded FPGA suitable for designs that require a large number of programmable logic elements, significant embedded memory, and a high I/O count in a compact BGA package. Its combination of logic resources, on‑chip RAM, and I/O density enables consolidation of complex digital functions on a single device.

As a member of the ECP3 family from Lattice Semiconductor, this device is supported by family documentation and datasheet resources, helping engineering teams evaluate integration, power, and thermal requirements for their designs.

Request a quote or submit an inquiry to check pricing and availability for the LFE3-150EA-6LFN672C. Our team can assist with lead time and order placement details.

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