LFE3-150EA-6FN672I

The LFE3-150EA-6FN672I is an ECP3 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It delivers a large programmable fabric with 149,000 logic elements and approximately 7.01 Mbits of embedded memory, addressing complex digital design requirements.

With 380 user I/Os, a 672‑BBGA surface-mount package (672‑FPBGA, 27×27), a supply voltage range of 1.14 V to 1.26 V, and an industrial operating temperature range of −40 °C to 100 °C, this device is specified for industrial applications that require high logic capacity, significant on-chip memory, and a robust physical package.

Key Features

• Core / Logic Elements 149,000 logic elements for implementing large-scale programmable logic and custom digital functions.
• Embedded Memory Approximately 7.01 Mbits of on-chip RAM to support buffering, state storage, and embedded data processing.
• I/O Count 380 user I/Os to connect multiple peripherals and interfaces without immediate reliance on external I/O expanders.
• Power Narrow supply voltage range of 1.14 V to 1.26 V for the core, enabling targeted power-supply design.
• Package & Mounting 672‑BBGA (supplier package 672‑FPBGA, 27×27) in a surface-mount configuration for compact board integration.
• Operating Range & Grade Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in temperature-demanding environments.
• Environmental Compliance RoHS compliant.

Unique Advantages

• Large programmable capacity: 149,000 logic elements provide headroom for complex state machines, custom datapaths, and parallel processing blocks.
• Integrated on-chip memory: Approximately 7.01 Mbits of embedded RAM helps reduce the need for external memory in many designs.
• High I/O density: 380 I/Os enable direct connection to numerous peripherals and interfaces, simplifying board-level routing and BOM.
• Industrial-ready temperature range: −40 °C to 100 °C supports deployment in harsh or variable environments.
• Compact, board-friendly package: 672‑BBGA (27×27) surface-mount package supports high-density designs while maintaining a standardized footprint.
• Regulatory alignment: RoHS compliance aligns with lead-free manufacturing requirements.

Why Choose LFE3-150EA-6FN672I?

The LFE3-150EA-6FN672I from Lattice Semiconductor offers a balance of large logic capacity, substantial embedded memory, and extensive I/O in a compact 672‑BBGA package. Its industrial temperature rating and narrow core voltage range make it well suited for designs that require reliable operation across a wide thermal envelope while maintaining controlled power characteristics.

This FPGA is appropriate for engineering teams and procurement sourcing components for industrial applications where on-chip resources, I/O density, and package density are key selection criteria. Backed by Lattice Semiconductor as the manufacturer, the device provides a clear specification set for system architects planning medium- to high-capacity programmable logic implementations.

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