LFE3-150EA-6LFN1156I

The LFE3-150EA-6LFN1156I is an ECP3 family Field Programmable Gate Array (FPGA) IC designed for programmable digital logic implementations. It combines high logic element count and embedded memory with a large I/O complement in a high-pin-count BGA package for space-efficient system integration.

Targeted at industrial applications, this device delivers a balance of integration and robustness through an industrial-grade temperature range, RoHS compliance, and a compact 1156-ball BGA package.

Key Features

• Logic Capacity  Provides 149000 logic elements suited for complex programmable logic designs and mid-to-high density implementations.
• Embedded Memory  Approximately 7.01 Mbits of on-chip RAM (7,014,400 bits) for buffering, state storage, and embedded data processing.
• High I/O Count  586 user I/O pins to support multiple parallel interfaces, wide bus connections, and extensive peripheral routing.
• Package and Mounting  1156-ball BBGA package (supplier package: 1156-FPBGA, 35×35) with surface-mount mounting for compact PCB layouts.
• Power  Core voltage supply range from 1.14 V to 1.26 V for defined power planning and supply design.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet industrial environmental requirements.
• Regulatory  RoHS compliant to support environmental and regulatory needs.

Typical Applications

• Industrial Control  Use the FPGA for custom digital control logic, sensor interfacing, and state-machine implementations in industrial automation systems.
• High‑Density I/O Systems  Leverage 586 I/O pins to implement multi-channel interfaces, bus bridging, and protocol aggregation on a single device.
• Embedded Data Processing  On-chip RAM and large logic capacity support buffering, packet handling, and application-specific data processing tasks.

Unique Advantages

• High Logic Integration: 149000 logic elements provide the capacity to consolidate multiple functions into a single device, reducing system BOM and board complexity.
• Substantial On‑chip Memory: Approximately 7.01 Mbits of embedded RAM supports local data storage and reduces dependence on external memory components.
• Extensive I/O Resources: 586 I/O pins enable flexible interfacing and high channel counts without additional I/O expanders.
• Industrial Reliability: Rated for −40 °C to 100 °C operation to meet industrial temperature requirements and support robust deployments.
• Compact High‑Pin Package: 1156-ball BGA (35×35) allows high pin density in a compact footprint for space-constrained PCB designs.
• RoHS Compliant: Conforms to RoHS standards to support environmentally compliant product builds.

Why Choose LFE3-150EA-6LFN1156I?

The LFE3-150EA-6LFN1156I positions itself as a high-capacity, industrial-grade FPGA option for designs that require substantial logic resources, significant embedded memory, and a large number of I/O connections within a compact BGA footprint. Its defined supply voltage range and wide operating temperature make it suitable for demanding embedded and industrial applications.

Choose this device when you need to consolidate complex digital functions, implement high-density I/O systems, or integrate sizable on-chip memory without expanding board-level components—delivering a scalable and robust building block for mid-to-high complexity FPGA designs.

Request a quote or contact sales to check pricing and availability for the LFE3-150EA-6LFN1156I and to discuss how it fits your design requirements.