LFE3-150EA-6FN1156ITW

The LFE3-150EA-6FN1156ITW is an ECP3 family Field Programmable Gate Array (FPGA) supplied in a 1156-BBGA surface-mount package. It delivers high logic capacity, substantial embedded RAM, and a large I/O count, packaged for industrial-grade temperature operation.

This device is suited to designs that require significant on-chip logic and memory resources combined with a wide I/O complement, while operating from a low-voltage core supply and across an industrial temperature range.

Key Features

• Core Logic  Approximately 149,000 logic elements providing high-density programmable logic capability; includes 18,625 LABs to structure logic resources.
• Embedded Memory  Approximately 7.01 Mbits of on-chip RAM to support buffering, state machines, and memory-intensive functions without external memory.
• I/O Capacity  586 user I/O pins for broad peripheral and bus interfacing, enabling complex connectivity and multi-channel designs.
• Power  Core voltage supply range of 1.14 V to 1.26 V for the device core.
• Package & Mounting  1156-BBGA package (supplier device package: 1156-FPBGA, 35×35 mm) in a surface-mount form factor for compact board-level integration.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for use in temperature-challenging environments.
• Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Implementation of complex control logic and I/O aggregation where industrial temperature range and high I/O counts are required.
• High-density Logic Implementations  Large-scale programmable logic functions that leverage the device's ~149,000 logic elements and 18,625 LABs.
• Memory-intensive FPGA Functions  Applications that benefit from approximately 7.01 Mbits of embedded memory for buffering, lookup tables, or state storage.

Unique Advantages

• High Logic Density: The device's ~149,000 logic elements and 18,625 LABs provide the capacity to implement complex digital designs on a single FPGA.
• Substantial On-chip Memory: Approximately 7.01 Mbits of embedded RAM reduces dependence on external memory components and simplifies PCB design.
• Extensive I/O Count: 586 I/O pins enable wide peripheral integration and multiple parallel interfaces without external multiplexing.
• Industrial Temperature Rating: Specified −40 °C to 100 °C operation supports deployment in harsh or temperature-variable environments.
• Compact BGA Packaging: 1156-BBGA (35×35 mm) surface-mount package balances high pin count with board-space efficiency for dense assemblies.
• Low-voltage Core Operation: Core supply range of 1.14–1.26 V supports power-optimized system design considerations.

Why Choose LFE3-150EA-6FN1156ITW?

The LFE3-150EA-6FN1156ITW is positioned for designs that need a high-capacity ECP3 FPGA with large embedded memory and extensive I/O in an industrial-temperature, surface-mount form factor. Its combination of logic density, on-chip RAM, and I/O capability makes it suitable for complex digital systems where integration and reliability across temperature extremes matter.

Choose this device when your project requires substantial programmable logic and memory resources in a compact 1156-BBGA package while meeting RoHS and industrial temperature requirements.

Request a quote or submit your inquiry for pricing and availability of the LFE3-150EA-6FN1156ITW to move your design forward.