LFE2M70SE-7FN900C
| Part Description |
ECP2M Field Programmable Gate Array (FPGA) IC 416 4642816 67000 900-BBGA |
|---|---|
| Quantity | 1,921 Available (as of May 4, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 900-FPBGA (31x31) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 900-BBGA | Number of I/O | 416 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 8375 | Number of Logic Elements/Cells | 67000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4642816 |
Overview of LFE2M70SE-7FN900C – ECP2M Field Programmable Gate Array (FPGA), 900-BBGA, 67,000 logic elements
The LFE2M70SE-7FN900C is a Field Programmable Gate Array (FPGA) from Lattice Semiconductor's ECP2M family. It combines high logic capacity with substantial on-chip memory and a large I/O count to support complex, high-pin-count designs.
Key device attributes include approximately 67,000 logic elements, approximately 4.64 Mbits of embedded RAM, 416 I/O pins, a 900-BBGA (900-FPBGA, 31×31) package, and low-voltage operation across a 1.14 V to 1.26 V supply range.
Key Features
- Core / Architecture ECP2M family Field Programmable Gate Array from Lattice Semiconductor, configured for high-capacity programmable logic.
- Logic Capacity Approximately 67,000 logic elements to implement complex combinational and sequential logic.
- Embedded Memory Approximately 4.64 Mbits of on-chip RAM (Total RAM Bits: 4,642,816) for data buffering and local storage.
- High I/O Count 416 available I/O pins to support dense interfacing and multiple peripheral connections.
- Power Supply Low-voltage core operation with a specified supply range of 1.14 V to 1.26 V.
- Package & Mounting 900-BBGA package (supplier package: 900-FPBGA, 31×31) optimized for surface-mount assembly.
- Operating Grade & Temperature Commercial-grade device rated for operation from 0 °C to 85 °C.
- Environmental Compliance RoHS compliant for lead-free assembly and regulatory alignment.
Unique Advantages
- High logic density: Approximately 67,000 logic elements enable integration of sizable digital functions without extensive external logic.
- Substantial on-chip memory: Approximately 4.64 Mbits of embedded RAM reduces reliance on external memory, simplifying BOM and board layout.
- Extensive I/O resources: 416 I/O pins provide flexibility for parallel interfaces, multiple peripherals, and complex connectivity requirements.
- Compact, high-pin-count package: 900-BBGA (900-FPBGA, 31×31) delivers high pin density in a surface-mount form factor suitable for space-conscious designs.
- Low-voltage operation: 1.14 V to 1.26 V supply range supports power-sensitive applications and system-level power optimization.
- Commercial temperature rating: 0 °C to 85 °C supports a wide range of standard commercial deployments.
Why Choose LFE2M70SE-7FN900C?
This FPGA is positioned for designs that require a combination of high logic capacity, meaningful on-chip RAM, and a large number of I/O in a compact surface-mount package. Its low-voltage core operation and RoHS compliance align with modern board-level power and environmental requirements.
Engineers specifying the LFE2M70SE-7FN900C gain a scalable programmable-logic option suitable for commercial-temperature applications that demand dense logic, integrated memory, and extensive I/O connectivity, all backed by the ECP2M family platform.
Request a quote or submit an inquiry to obtain pricing and lead-time information for the LFE2M70SE-7FN900C.
