LFE2M70SE-6FN900I

The LFE2M70SE-6FN900I is an ECP2M Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation configured in a 900‑ball BGA. It provides a large programmable fabric with 67,000 logic elements and approximately 4.64 Mbits of embedded memory, supporting designs that require substantial on‑chip logic and memory resources.

With 416 I/O and industrial temperature grading, this surface‑mount device is intended for system designs that need high I/O density, significant embedded RAM capacity, and operation across a wide temperature range.

Key Features

• Core Logic – 67,000 logic elements for implementing complex digital functions and custom logic architectures.
• Embedded Memory – Approximately 4.64 Mbits of on‑chip RAM to support buffering, packet queues, and local data storage within the FPGA fabric.
• I/O Density – 416 user I/O pins to accommodate multiple parallel interfaces, sensor connections, and peripheral controls.
• Power – Low core supply range from 1.14 V to 1.26 V to match system power rails and support efficient core operation.
• Package and Mounting – 900‑BBGA package (supplier device package: 900‑FPBGA, 31×31) in a surface‑mount form factor for compact, high‑density PCB integration.
• Temperature and Grade – Industrial grade device rated for operation from −40 °C to 100 °C for deployment in temperature‑challenging environments.
• RoHS Compliance – RoHS compliant for regulatory and environmental compatibility.

Typical Applications

• Industrial Automation – Use the device’s industrial temperature range and high I/O count for control logic, motor drives, and industrial interface aggregation.
• Communications Equipment – Leverage abundant logic elements and on‑chip RAM for protocol processing, packet handling, and interface bridging.
• Data Acquisition and Signal Processing – Large embedded memory and many I/O support buffering and aggregation of sensor data and front‑end processing tasks.

Unique Advantages

• High Logic Capacity: 67,000 logic elements provide headroom for complex, multi‑function designs without external programmable logic.
• Substantial On‑Chip Memory: Approximately 4.64 Mbits of RAM reduces dependence on external memory for many buffering and state‑storage needs.
• Extensive I/O: 416 I/O pins enable integration of numerous interfaces and peripherals directly to the FPGA fabric.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in demanding environments.
• Compact BGA Packaging: 900‑BBGA (900‑FPBGA, 31×31) surface‑mount package supports high‑density PCB layouts while delivering thermal and mechanical stability.
• Regulatory Compliance: RoHS compliant for environmentally conscious designs and global market acceptance.

Why Choose LFE2M70SE-6FN900I?

The LFE2M70SE-6FN900I positions itself as a robust, industrial‑grade FPGA option with a balance of large logic capacity, meaningful on‑chip memory, and high I/O density packaged in a compact 900‑ball BGA. Its low core voltage range and RoHS compliance align with modern power and regulatory requirements.

This device is well suited for engineering teams designing industrial control systems, communications equipment, and data acquisition units that require significant programmable logic, embedded RAM, and a high count of external interfaces while operating across a wide temperature range.

Request a quote or submit a sales inquiry to obtain pricing, availability, and support for integrating the LFE2M70SE-6FN900I into your next design.