LFE2M70SE-7F900C

The LFE2M70SE-7F900C is a commercial-grade Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation within the ECP2M family. It provides a high-density programmable fabric with 67,000 logic elements and substantial embedded memory for configurable logic designs.

Designed for commercial electronic systems, the device combines a large logic-capacity, approximately 4.64 Mbits of on-chip RAM, and up to 416 user I/O in a 900-ball BGA package, offering a balance of integration and I/O density for board-level implementations operating at standard commercial temperatures.

Key Features

• Core Logic 67,000 logic elements provide the programmable resources required for complex digital designs and custom logic implementations.
• Embedded Memory Approximately 4.64 Mbits of on-chip RAM supports buffering, state storage, and memory-mapped logic without relying solely on external memory.
• I/O Density Up to 416 user I/O pins enable connectivity to multiple peripherals, buses, and external interfaces on a single device.
• Power Supply Core voltage support from 1.14 V to 1.26 V reflects the device's low-voltage core domain requirements.
• Package 900-ball BGA in a 31 × 31 mm FPBGA form factor (900-FPBGA) provides a compact footprint suitable for surface-mount board designs.
• Mounting & Grade Surface-mount device designed for commercial-grade applications with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS-compliant construction meets common environmental requirements for commercial electronics.

Typical Applications

• Commercial Embedded Systems — Implement custom logic, control functions, and feature-rich subsystems that benefit from reprogrammability and substantial on-chip memory.
• High-Density I/O Interfaces — Use the 416 I/O pins to bridge multiple peripherals, buses, or sensor arrays on a single board without extensive external glue logic.
• Memory-Intensive Logic — Leverage approximately 4.64 Mbits of embedded RAM for buffering, packet handling, or stateful processing within the FPGA fabric.
• Compact Board-Level Integration — The 900-ball 31 × 31 FPBGA package supports dense, surface-mount deployments where board space and I/O routing matter.

Unique Advantages

• High Logic Capacity: 67,000 logic elements enable implementation of sizeable custom digital designs without immediate need for multiple devices.
• Significant On-Chip Memory: Approximately 4.64 Mbits of embedded RAM reduces dependence on external memory for buffering and state management.
• Extensive I/O: 416 user I/O pins simplify system integration by providing direct connections to a wide range of peripherals and interfaces.
• Compact BGA Packaging: The 900-FPBGA (31 × 31 mm) package supports dense board layouts and surface-mount assembly practices.
• Low-Voltage Core: 1.14 V to 1.26 V supply range aligns with modern low-voltage FPGA core domains for efficient power design.
• Commercial Grade and RoHS Compliant: Rated for 0 °C to 85 °C operation and manufactured to meet RoHS environmental standards.

Why Choose LFE2M70SE-7F900C?

The LFE2M70SE-7F900C offers a balance of substantial programmable logic, embedded memory, and high I/O count in a compact 900-ball BGA package for commercial electronic designs. Its specifications make it suitable for engineers seeking a single-device solution to implement complex logic, memory-intensive functions, and multiple interface connections within commercial temperature ranges.

As a member of the ECP2M family from Lattice Semiconductor Corporation, this FPGA is positioned for designers who require scalable programmable resources, on-chip memory capacity, and a high pin-count package for board-level integration and product development across a range of commercial applications.

Request a quote or submit a procurement inquiry to obtain pricing, availability, and further technical details for the LFE2M70SE-7F900C.