LFE2M70SE-6FN1152C

The LFE2M70SE-6FN1152C is a commercial-grade ECP2M FPGA from Lattice Semiconductor Corporation, offering a high-density programmable fabric in a 1152-BBGA package. With 67,000 logic elements, approximately 4.64 Mbits of embedded memory and 436 general-purpose I/O pins, this device targets designs that require substantial logic capacity and extensive I/O integration while operating within a standard commercial temperature range.

Key Features

• Core Logic 67,000 logic elements provide large-scale programmable logic suitable for complex combinational and sequential designs.
• Embedded Memory Approximately 4.64 Mbits of on-chip RAM for implementing FIFOs, buffers, and on-chip data storage without external memory.
• I/O Density 436 user I/O pins support extensive peripheral interfacing and multi-channel I/O requirements.
• Power Operates from a core supply range of 1.14 V to 1.26 V, enabling predictable power planning for the core domain.
• Package and Mounting 1152-BBGA (supplier device package: 1152-FPBGA, 35×35 mm) in a surface-mount form factor for high-density PCB integration.
• Temperature and Grade Commercial grade device with an operating range of 0 °C to 85 °C, suitable for standard commercial applications.
• Compliance RoHS compliant to support environmental and regulatory requirements for commercial electronic assemblies.

Typical Applications

• High-density I/O Systems Use the 436 I/Os to aggregate and manage multiple parallel interfaces, sensors, or peripheral lanes in communication or instrumentation gear.
• Data Buffering and Packet Processing Leverage approximately 4.64 Mbits of on-chip RAM to implement packet queues, FIFOs, and other buffering tasks without immediate external memory.
• Embedded Logic and Glue-Logic Deploy the 67,000 logic elements for protocol bridging, custom peripherals, or system glue logic in complex embedded platforms.
• Prototyping and System Integration Surface-mount 1152-BBGA package provides a compact form factor for integrating high-density programmable logic into prototype and production PCBs.

Unique Advantages

• High Logic Capacity: 67,000 logic elements enable implementation of sizable digital functions and state machines on a single device, reducing system complexity.
• Substantial On-chip Memory: Approximately 4.64 Mbits of embedded RAM reduces reliance on external memory for buffering and temporary storage, simplifying system BOM.
• Extensive I/O Count: 436 I/Os allow direct connection to many peripherals and interfaces, minimizing the need for additional I/O expanders.
• Compact, High-density Package: 1152-BBGA (35×35 mm) surface-mount package provides a balance of I/O availability and PCB area efficiency for space-constrained designs.
• Commercial-grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for consistent performance in standard commercial environments.

Why Choose LFE2M70SE-6FN1152C?

The LFE2M70SE-6FN1152C positions itself as a high-density commercial FPGA solution, combining 67,000 logic elements, approximately 4.64 Mbits of embedded RAM, and 436 I/Os in a single 1152-BBGA package. This combination delivers a practical balance of programmable logic capacity, memory resources, and I/O bandwidth for designs that require significant on-chip resources without moving to specialized temperature grades.

Engineers and procurement teams building communication interfaces, data buffering systems, or dense embedded controllers will find this device suited to designs that demand integration and scalability within standard commercial operating conditions.

Request a quote or submit an inquiry to receive pricing and availability for the LFE2M70SE-6FN1152C and to discuss how this FPGA can fit your next design.