LFE3-150EA-6FN672C

The LFE3-150EA-6FN672C is a Lattice ECP3 family Field Programmable Gate Array (FPGA) device offering approximately 149,000 logic elements in a 672-ball BGA package. It combines dense reconfigurable logic, substantial on-chip RAM, and flexible I/O to address high-volume, high-speed embedded designs.

Designed for system integration, this device provides approximately 7.01 Mbits of embedded memory, up to 380 user I/Os, and support for high-speed serial interfaces and DSP resources, making it suitable for communications, video/broadcast, and advanced signal-processing applications.

Key Features

• Core Logic  Approximately 149,000 logic elements for complex logic integration and large-function implementations.
• Embedded Memory  Approximately 7.01 Mbits of on-chip RAM (7,014,400 total RAM bits) to support large buffers, FIFOs and on-chip data storage.
• DSP and Multiply Resources  Dedicated sysDSP architecture and 18×18 multipliers (device family resources) for high-performance multiply-accumulate operations and signal processing acceleration.
• High-Speed Serial I/O (SERDES)  Family-level embedded SERDES support with data rates from 150 Mbps to 3.2 Gbps and protocol support for PCI Express, SONET/SDH, Ethernet (1GbE, SGMII, XAUI), CPRI, SMPTE 3G and Serial RapidIO.
• Programmable I/O Standards  Broad I/O standard support and source-synchronous features (device family capabilities) to interface with ADC/DACs and a wide range of parallel and differential standards; this package provides 380 user I/Os.
• Clocking  Multiple on-chip PLLs and DLLs (family-level support) for flexible clock management and high-speed interface timing.
• Configuration and System Utilities  Flexible configuration options including SPI boot flash interface and dual-boot image support; device family tools include Reveal Logic Analyzer and ORCAstra FPGA configuration utility.
• Package, Power and Mounting  672-BBGA package (supplier device package listed as 672-FPBGA, 27 × 27 mm), surface-mount mounting, and core voltage supply range of 1.14 V to 1.26 V.
• Environment and Compliance  Commercial-grade device with operating temperature range 0 °C to 85 °C and RoHS compliance.

Typical Applications

• High-Speed Communications  Implement protocol bridging, packet processing and SERDES-based links using the device’s high-speed serial interfaces and abundant I/O.
• Networking and Storage  Deploy PHY-level interfaces, traffic management and protocol offloads where large on-chip RAM and extensive logic capacity accelerate packet buffering and control functions.
• Video and Broadcast  Support SMPTE 3G and other video interfaces with source-synchronous I/O and on-chip DSP resources for video processing and frame buffering.
• Data Acquisition and Signal Processing  Use the sysDSP slices and dedicated multipliers for real-time filtering, FFTs, and multi-channel ADC/DAC interfacing.

Unique Advantages

• Highly integrated logic and memory: Combines approximately 149,000 logic elements with ~7.01 Mbits of on-chip RAM to reduce external memory needs and simplify board design.
• Flexible high-speed I/O: 380 user I/Os and family SERDES support for a wide range of serial protocols enable dense, high-bandwidth system interfaces.
• DSP acceleration: Dedicated multiply resources and sysDSP architecture speed signal-processing workloads and offload computations from embedded processors.
• Field-configurable system support: SPI boot, dual-boot capability and device family configuration utilities support in-field updates and secure deployment workflows.
• Commercial-grade and compliant: RoHS-compliant and specified for 0 °C to 85 °C operation, suitable for a broad set of commercial embedded applications.

Why Choose LFE3-150EA-6FN672C?

The LFE3-150EA-6FN672C positions itself as a dense, versatile FPGA option in the ECP3 family, offering a combination of high logic capacity, substantial embedded memory, extensive I/O and family-level high-speed serial capabilities. It is well suited to designers building communications, video, networking and signal-processing systems that require on-chip memory, DSP resources and flexible interface support.

With commercial-grade temperature range, surface-mount 672-BBGA packaging and standard configuration options, the device supports scalable designs and integration into existing tool flows using family-provided utilities for configuration and debugging.

Request a quote or submit a pricing inquiry for LFE3-150EA-6FN672C to check availability and lead times for your next design.