LFE3-150EA-6LFN672I

The LFE3-150EA-6LFN672I is an industrial-grade FPGA from the Lattice ECP3 family, delivering a high-density, economical reconfigurable fabric for system integration. Built on the ECP3 architecture, this device combines a large logic capacity with significant embedded memory and a broad set of I/O resources to address high-speed communications, video and broadcast, and general-purpose embedded processing applications.

Key Features

• Core Capacity — 149,000 logic elements to implement complex logic, glue, and protocol processing.
• On-chip Memory — Approximately 7.01 Mbits of embedded memory (7,014,400 total RAM bits) for buffering, packet storage, and local data processing.
• DSP Resources — Device-level support from the ECP3 family includes up to 320 18×18 multipliers for high-throughput multiply-accumulate and DSP tasks.
• High-speed SERDES (family capability) — ECP3 family SERDES support for multi-protocol, high-speed serial links with data rates noted in the family datasheet from 150 Mbps to 3.2 Gbps and multi-channel configurations.
• I/O — 380 user I/Os providing broad parallel interface capability for peripherals, memory buses, and board-level interfaces.
• Programmable I/O Standards (family capability) — Family-level sysI/O supports LVTTL/LVCMOS, SSTL, HSTL, LVDS and a range of common differential and single-ended standards as documented in the ECP3 family datasheet.
• Clocking and Timing (family capability) — Family includes PLLs and DLLs (up to ten PLLs and two DLLs reported in the family datasheet) for flexible clocking and deskewing architectures.
• Package — 672-BBGA (supplier device package: 672-FPBGA, 27 × 27 mm) suited to compact, high-density board designs.
• Power — Core supply range specified at 1.14 V to 1.26 V.
• Industrial Operating Range — Rated for −40 °C to 100 °C operation.
• Compliance — RoHS compliant.

Typical Applications

• High-speed Networking and Telecom — Implements protocol processing, packet buffering and SERDES-based serial links used in Ethernet, SONET/SDH, and packet-transport systems (family SERDES capability documented in the datasheet).
• Broadcast and Video Processing — Supports SMPTE 3G and other video interfaces where on-chip memory and DSP multipliers accelerate frame buffering and signal processing.
• Embedded System Integration — Acts as a central logic hub for complex embedded designs requiring dense logic, abundant I/O, and local memory for control, protocol conversion, or custom peripherals.
• Data Acquisition and Interface Bridging — Large embedded RAM and DSP resources enable local data aggregation, preprocessing, and real-time interfacing to ADC/DAC and high-speed serial links (family I/O and DDR support referenced in the datasheet).

Unique Advantages

• High Logic Density: 149,000 logic elements allow consolidation of multiple functions into a single device, reducing board-level part counts.
• Substantial Embedded Memory: Approximately 7.01 Mbits on-chip memory supports deep buffering and lookup tables without external RAM.
• Rich DSP Capability: Support for up to 320 18×18 multipliers enables efficient implementation of DSP algorithms and signal processing chains.
• Broad I/O and Serial Link Support: 380 I/Os combined with the ECP3 family’s SERDES and programmable sysI/O enable flexible interfacing to a wide range of peripherals and high-speed links.
• Industrial Temperature Rating: −40 °C to 100 °C operation provides suitability for a wide range of industrial environments.
• Compact, High-density Package: 672-FPBGA (27 × 27 mm) delivers a balance of pin count and board area for space-constrained designs.

Why Choose LFE3-150EA-6LFN672I?

The LFE3-150EA-6LFN672I positions itself as a high-density, industrial-grade programmable device within the Lattice ECP3 family, combining substantial logic resources, large on-chip memory, and broad I/O capability in a compact 672-BBGA package. It is suited for designers who need to consolidate board-level functions, implement high-speed serial interfaces, and deploy robust systems across industrial temperature ranges.

Supported by the ECP3 family’s configuration and system tools (as described in the family datasheet), the device provides a practical platform for scalable designs that require reliable performance, flexible I/O standards, and in-field configurability.

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