LFE3-150EA-7FN672I

The LFE3-150EA-7FN672I is an ECP3 family Field Programmable Gate Array (FPGA) supplied in a 672-ball BGA package. It provides a high-density programmable fabric with a substantial on-chip memory complement and a large I/O count for complex logic integration.

Designed for industrial-grade applications, this device combines 149,000 logic elements with approximately 7.01 Mbits of embedded memory and 380 user I/Os, while supporting a core supply range of 1.14 V to 1.26 V and an operating temperature range of −40 °C to 100 °C.

Key Features

• Core Logic  Provides 149,000 logic elements for implementing high-density custom logic, state machines, and glue logic.
• Embedded Memory  Approximately 7.01 Mbits of on-chip RAM to support buffering, lookup tables, and data processing without external memory in many designs.
• I/O Capacity  380 general-purpose I/Os to interface with multiple peripherals, sensors, and external devices.
• Power Supply  Operates from a core voltage range of 1.14 V to 1.26 V, enabling predictable power budgeting and system-level design.
• Package & Mounting  672-ball FPBGA (27 × 27 mm) package in a 672-BBGA footprint, intended for surface-mount assembly.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet demanding environmental conditions.
• Regulatory Compliance  RoHS-compliant construction to meet standard environmental directives.

Unique Advantages

• High integration density: 149,000 logic elements reduce the need for multiple discrete devices and simplify board-level integration.
• Substantial on-chip memory: Approximately 7.01 Mbits of embedded RAM supports data buffering and local storage, lowering external memory requirements.
• Extensive I/O resources: 380 I/Os enable broad connectivity options for complex system interfaces and parallel data paths.
• Industrial thermal capability: −40 °C to 100 °C rating supports deployment in temperature-stressed environments.
• Compact BGA package: 672-ball FPBGA (27×27) provides a balance of pin count and PCB area for dense designs.
• RoHS-compliant: Meets environmental compliance expectations for modern electronic assemblies.

Why Choose LFE3-150EA-7FN672I?

The LFE3-150EA-7FN672I positions itself as a robust, industrial-grade FPGA option for designs requiring large logic capacity, significant on-chip memory, and abundant I/O. Its combination of 149,000 logic elements, approximately 7.01 Mbits of embedded RAM, and 380 I/Os provides the integration density needed to consolidate functions and reduce overall BOM complexity.

With a defined core voltage range and an extended operating temperature window, this device supports reliable operation in demanding environments while the 672-ball FPBGA package balances high pin count with a compact footprint. RoHS compliance further aligns the device with contemporary manufacturing and regulatory requirements.

Request a quote or submit a purchase inquiry today to evaluate how the LFE3-150EA-7FN672I can meet your industrial FPGA requirements.