LFE3-150EA-7LFN1156I

The LFE3-150EA-7LFN1156I is an ECP3 family FPGA device offering 149,000 logic elements and a high-density I/O fabric with 586 user I/Os. Built on the LatticeECP3 architecture, it combines programmable logic, embedded memory and advanced DSP and SERDES resources to address high-speed, high-integration applications.

This device is targeted at markets requiring multi-gigabit serial connectivity, DSP acceleration and flexible I/O standards while supporting industrial-grade operating conditions and surface-mount 1156-BBGA packaging.

Key Features

• Core Logic 149,000 logic elements delivering a high logic density for system integration and complex FPGA designs.
• Embedded Memory Total on-chip RAM: 7,014,400 bits (approximately 7.0 Mbits) of embedded memory for buffers, FIFOs and data storage.
• High I/O Count Up to 586 user I/Os to support wide parallel interfaces, high pin-count peripherals and extensive board-level connectivity.
• Embedded SERDES Multi-gigabit SERDES supporting data rates from 150 Mbps to 3.2 Gbps and family-level support for up to 16 channels for protocols such as PCI Express, SONET/SDH, Ethernet, CPRI, SMPTE 3G and Serial RapidIO.
• sysDSP Slices Cascadable sysDSP slice architecture with high-performance multiply-accumulate capabilities, supporting advanced ALU operations and multiple multiplier configurations.
• Clocking and Timing Device-level support includes up to ten PLLs and two DLLs to enable flexible clock management across the design.
• Flexible I/O Standards Programmable I/O buffer support for a wide range of interfaces including LVTTL/LVCMOS, SSTL, HSTL, LVDS and other differential and single-ended standards.
• Package & Power Surface-mount 1156-BBGA (supplier package: 1156-FPBGA, 35 × 35 mm) and a core voltage supply range of 1.14 V to 1.26 V.
• Industrial Temperature Rating Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• RoHS Compliant Device is RoHS compliant.

Typical Applications

• Networking & Telecom — Multi-gigabit SERDES and high I/O counts enable implementations such as Ethernet PHY aggregation, PCI Express endpoints and telecom interfaces (SONET/SDH, CPRI).
• Video & Broadcast — High-speed serial channels and abundant embedded memory support video transport protocols including SMPTE 3G and high-bandwidth data paths.
• High-Performance DSP — sysDSP slices and numerous multipliers make the device well-suited for signal processing tasks, filtering and MAC-intensive algorithms.
• Industrial Systems — Industrial temperature rating and a compact 1156-BBGA package fit control, automation and instrumentation applications requiring robust operation.

Unique Advantages

• High Logic Density: 149,000 logic elements allow substantial on-chip integration, reducing external components and simplifying system design.
• Multi‑Megabit Embedded Memory: Approximately 7.0 Mbits of on-chip RAM for buffering, packet handling and local data storage without external memory.
• Multi‑Gigabit Serial Connectivity: SERDES capability up to 3.2 Gbps and multi-channel support for contemporary high-speed protocols.
• Flexible I/O and Protocol Support: Programmable sysI/O buffers and a wide set of supported I/O standards enable direct interfacing to diverse peripherals and memory subsystems.
• Industrial‑Grade Operation: −40 °C to 100 °C operating range and a robust BGA package accommodate demanding environmental conditions.
• Comprehensive Clocking Resources: Multiple PLLs and DLLs give designers flexibility to implement complex clocking and low-jitter timing schemes.

Why Choose LFE3-150EA-7LFN1156I?

The LFE3-150EA-7LFN1156I positions itself as a high-density, feature-rich FPGA solution for designs that require extensive logic, abundant embedded memory and high-speed serial connectivity in a single, industrial-temperature device. Its combination of sysDSP acceleration, flexible I/O standards and multi‑gigabit SERDES channels makes it appropriate for communication, video, DSP and industrial control applications where integration and deterministic performance are important.

Designed in the LatticeECP3 family architecture, this device offers a balance of performance and system-level integration while supporting industry-standard packaging and a broad tool and configuration ecosystem referenced by the family data. It fits teams and projects seeking scalable FPGA resources with industrial operating margins.

Request a quote or submit an inquiry to check pricing and availability for the LFE3-150EA-7LFN1156I and to discuss how it fits your next design.