LFE3-150EA-7LFN672I

IC FPGA 380 I/O 672FPBGA
Part Description

ECP3 Field Programmable Gate Array (FPGA) IC 380 7014400 149000 672-BBGA

Quantity 1,016 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package672-FPBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BBGANumber of I/O380Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs18625Number of Logic Elements/Cells149000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits7014400

Overview of LFE3-150EA-7LFN672I – ECP3 Field Programmable Gate Array (FPGA) IC 380 7014400 149000 672-BBGA

The LFE3-150EA-7LFN672I is an ECP3-series FPGA from Lattice Semiconductor Corporation designed for high-density, industrial-grade logic integration. It delivers 149,000 logic elements, a large on-chip memory footprint and a high I/O count in a compact BGA package for demanding embedded designs.

Engineered for applications that require substantial programmable logic along with robust operating conditions, the device operates from a 1.14 V to 1.26 V core supply and supports an industrial temperature range of −40 °C to 100 °C.

Key Features

  • Logic Capacity — 149,000 logic elements to implement complex digital logic and custom hardware functions.
  • Embedded Memory — Approximately 7.01 Mbits of on-chip RAM for buffering, FIFOs, and state storage without external memory.
  • I/O Density — 380 user I/Os to support multiple interfaces and parallel connectivity in a single device.
  • Package & Mounting — 672-BBGA package (supplier device package: 672-FPBGA, 27×27) with surface-mount mounting for compact PCB layouts.
  • Power — Core voltage supply range of 1.14 V to 1.26 V for defined power budget and compatibility with low-voltage systems.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet industrial environmental requirements.
  • Regulatory Compliance — RoHS compliant to support environmental and manufacturing requirements.

Typical Applications

  • High-density FPGA designs — Implement large-scale logic functions and custom hardware accelerators using 149,000 logic elements.
  • Memory-intensive processing — Use approximately 7.01 Mbits of embedded RAM for packet buffering, data staging, and state machines.
  • Multi-interface systems — Support systems requiring many parallel or mixed I/Os with 380 available user I/Os.
  • Industrial embedded systems — Deploy in industrial environments that demand operation across −40 °C to 100 °C and surface-mount packaging.

Unique Advantages

  • High logic density: 149,000 logic elements enable integration of complex functions into a single FPGA, reducing component count.
  • Significant on-chip memory: Approximately 7.01 Mbits of embedded RAM minimize reliance on external memory and simplify board design.
  • Extensive I/O availability: 380 I/Os provide flexibility for parallel interfaces, multiple peripherals, and complex system interconnects.
  • Industrial-grade temperature support: −40 °C to 100 °C rating supports deployment in challenging environmental conditions.
  • Compact BGA footprint: 672-BBGA (27×27 FPBGA) surface-mount package delivers high pin count in a space-conscious form factor.
  • RoHS compliant: Meets lead-free manufacturing and environmental standards for modern production processes.

Why Choose LFE3-150EA-7LFN672I?

The LFE3-150EA-7LFN672I is positioned for engineers and procurement teams seeking a high-capacity, industrial-grade FPGA with ample on-chip memory and I/O resources. Its combination of 149,000 logic elements, approximately 7.01 Mbits of embedded RAM, and 380 I/Os makes it suitable for consolidating complex digital functions into a single device.

Backed by Lattice Semiconductor Corporation and delivered in a compact 672-BBGA surface-mount package with a wide operating temperature range, this device offers a scalable, robust option for long-term deployment in industrial and high-density embedded applications.

Request a quote or submit an inquiry today to evaluate the LFE3-150EA-7LFN672I for your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1983


    Headquarters: Hillsboro, Oregon, USA


    Employees: 1,000+


    Revenue: $627.7 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up