LFE3-150EA-7LFN672I
| Part Description |
ECP3 Field Programmable Gate Array (FPGA) IC 380 7014400 149000 672-BBGA |
|---|---|
| Quantity | 1,016 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FPBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 380 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 18625 | Number of Logic Elements/Cells | 149000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 7014400 |
Overview of LFE3-150EA-7LFN672I – ECP3 Field Programmable Gate Array (FPGA) IC 380 7014400 149000 672-BBGA
The LFE3-150EA-7LFN672I is an ECP3-series FPGA from Lattice Semiconductor Corporation designed for high-density, industrial-grade logic integration. It delivers 149,000 logic elements, a large on-chip memory footprint and a high I/O count in a compact BGA package for demanding embedded designs.
Engineered for applications that require substantial programmable logic along with robust operating conditions, the device operates from a 1.14 V to 1.26 V core supply and supports an industrial temperature range of −40 °C to 100 °C.
Key Features
- Logic Capacity — 149,000 logic elements to implement complex digital logic and custom hardware functions.
- Embedded Memory — Approximately 7.01 Mbits of on-chip RAM for buffering, FIFOs, and state storage without external memory.
- I/O Density — 380 user I/Os to support multiple interfaces and parallel connectivity in a single device.
- Package & Mounting — 672-BBGA package (supplier device package: 672-FPBGA, 27×27) with surface-mount mounting for compact PCB layouts.
- Power — Core voltage supply range of 1.14 V to 1.26 V for defined power budget and compatibility with low-voltage systems.
- Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet industrial environmental requirements.
- Regulatory Compliance — RoHS compliant to support environmental and manufacturing requirements.
Typical Applications
- High-density FPGA designs — Implement large-scale logic functions and custom hardware accelerators using 149,000 logic elements.
- Memory-intensive processing — Use approximately 7.01 Mbits of embedded RAM for packet buffering, data staging, and state machines.
- Multi-interface systems — Support systems requiring many parallel or mixed I/Os with 380 available user I/Os.
- Industrial embedded systems — Deploy in industrial environments that demand operation across −40 °C to 100 °C and surface-mount packaging.
Unique Advantages
- High logic density: 149,000 logic elements enable integration of complex functions into a single FPGA, reducing component count.
- Significant on-chip memory: Approximately 7.01 Mbits of embedded RAM minimize reliance on external memory and simplify board design.
- Extensive I/O availability: 380 I/Os provide flexibility for parallel interfaces, multiple peripherals, and complex system interconnects.
- Industrial-grade temperature support: −40 °C to 100 °C rating supports deployment in challenging environmental conditions.
- Compact BGA footprint: 672-BBGA (27×27 FPBGA) surface-mount package delivers high pin count in a space-conscious form factor.
- RoHS compliant: Meets lead-free manufacturing and environmental standards for modern production processes.
Why Choose LFE3-150EA-7LFN672I?
The LFE3-150EA-7LFN672I is positioned for engineers and procurement teams seeking a high-capacity, industrial-grade FPGA with ample on-chip memory and I/O resources. Its combination of 149,000 logic elements, approximately 7.01 Mbits of embedded RAM, and 380 I/Os makes it suitable for consolidating complex digital functions into a single device.
Backed by Lattice Semiconductor Corporation and delivered in a compact 672-BBGA surface-mount package with a wide operating temperature range, this device offers a scalable, robust option for long-term deployment in industrial and high-density embedded applications.
Request a quote or submit an inquiry today to evaluate the LFE3-150EA-7LFN672I for your next design.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016