LFE3-150EA-8FN672C
| Part Description |
ECP3 Field Programmable Gate Array (FPGA) IC 380 7014400 149000 672-BBGA |
|---|---|
| Quantity | 358 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FPBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 380 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 18625 | Number of Logic Elements/Cells | 149000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 7014400 |
Overview of LFE3-150EA-8FN672C – ECP3 Field Programmable Gate Array (FPGA) IC 380 7014400 149000 672-BBGA
The LFE3-150EA-8FN672C is a Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation designed for commercial electronic applications. It delivers significant programmable logic capacity, embedded memory, and a high count of user I/O in a compact surface-mount BBGA package.
With a supply range centered around low-voltage operation and an ambient operating range for commercial environments, this device targets designs that require flexible on-chip logic, on-chip memory, and abundant I/O connectivity.
Key Features
- Logic Capacity Approximately 149,000 logic elements, providing substantial programmable logic resources for complex designs.
- Embedded Memory Approximately 7.0 Mbits of on-chip RAM (7,014,400 total RAM bits) to support buffering, lookup tables, and embedded data storage.
- I/O Density 380 user I/Os to support multiple peripheral interfaces and parallel connectivity options.
- Package and Mounting 672-BBGA package in a 672-FPBGA (27×27 mm) supplier package; surface-mount mounting type for compact board designs.
- Power Operates from a supply range of 1.14 V to 1.26 V, enabling low-voltage system integration.
- Operating Range Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Compliance RoHS compliant for environmentally conscious designs and regulatory alignment.
Typical Applications
- Commercial Embedded Systems Implement custom logic functions and data processing pipelines in general-purpose embedded designs.
- Interface and I/O Aggregation Consolidate multiple interfaces and parallel signals using its 380 user I/Os for connectivity-intensive applications.
- On-Chip Memory-Dependent Logic Leverage approximately 7.0 Mbits of embedded memory for buffering, LUTs, and small data storage within FPGA logic.
Unique Advantages
- High Logic Density: Approximately 149,000 logic elements enable implementation of sizable custom logic functions on a single device, reducing external component count.
- Significant On-Chip Memory: Approximately 7.0 Mbits of embedded RAM supports local buffering and state storage without external memory.
- Extensive I/O Availability: 380 user I/Os accommodate multiple peripherals and parallel buses, simplifying board-level routing for I/O-heavy designs.
- Compact, Surface-Mount Package: 672-BBGA (672-FPBGA, 27×27) package offers a space-efficient solution for dense board layouts.
- Low-Voltage Operation: Narrow supply range (1.14 V–1.26 V) suitable for modern low-voltage system architectures.
- Commercial Temperature Rating: Rated for 0 °C to 85 °C, aligned with a wide range of commercial applications.
Why Choose LFE3-150EA-8FN672C?
The LFE3-150EA-8FN672C combines substantial programmable logic resources, meaningful on-chip memory, and abundant I/O in a compact 672-BBGA surface-mount package. Its low-voltage operation and commercial temperature rating make it well suited for commercial embedded systems that require a balance of integration and board-space efficiency.
This device is appropriate for designers seeking to consolidate logic, memory, and I/O on a single FPGA to simplify BOM and tighten system integration while maintaining environmental compliance through RoHS alignment.
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