LFE3-150EA-8FN672C

IC FPGA 380 I/O 672FPBGA
Part Description

ECP3 Field Programmable Gate Array (FPGA) IC 380 7014400 149000 672-BBGA

Quantity 358 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package672-FPBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O380Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs18625Number of Logic Elements/Cells149000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits7014400

Overview of LFE3-150EA-8FN672C – ECP3 Field Programmable Gate Array (FPGA) IC 380 7014400 149000 672-BBGA

The LFE3-150EA-8FN672C is a Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation designed for commercial electronic applications. It delivers significant programmable logic capacity, embedded memory, and a high count of user I/O in a compact surface-mount BBGA package.

With a supply range centered around low-voltage operation and an ambient operating range for commercial environments, this device targets designs that require flexible on-chip logic, on-chip memory, and abundant I/O connectivity.

Key Features

  • Logic Capacity  Approximately 149,000 logic elements, providing substantial programmable logic resources for complex designs.
  • Embedded Memory  Approximately 7.0 Mbits of on-chip RAM (7,014,400 total RAM bits) to support buffering, lookup tables, and embedded data storage.
  • I/O Density  380 user I/Os to support multiple peripheral interfaces and parallel connectivity options.
  • Package and Mounting  672-BBGA package in a 672-FPBGA (27×27 mm) supplier package; surface-mount mounting type for compact board designs.
  • Power  Operates from a supply range of 1.14 V to 1.26 V, enabling low-voltage system integration.
  • Operating Range  Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Compliance  RoHS compliant for environmentally conscious designs and regulatory alignment.

Typical Applications

  • Commercial Embedded Systems  Implement custom logic functions and data processing pipelines in general-purpose embedded designs.
  • Interface and I/O Aggregation  Consolidate multiple interfaces and parallel signals using its 380 user I/Os for connectivity-intensive applications.
  • On-Chip Memory-Dependent Logic  Leverage approximately 7.0 Mbits of embedded memory for buffering, LUTs, and small data storage within FPGA logic.

Unique Advantages

  • High Logic Density: Approximately 149,000 logic elements enable implementation of sizable custom logic functions on a single device, reducing external component count.
  • Significant On-Chip Memory: Approximately 7.0 Mbits of embedded RAM supports local buffering and state storage without external memory.
  • Extensive I/O Availability: 380 user I/Os accommodate multiple peripherals and parallel buses, simplifying board-level routing for I/O-heavy designs.
  • Compact, Surface-Mount Package: 672-BBGA (672-FPBGA, 27×27) package offers a space-efficient solution for dense board layouts.
  • Low-Voltage Operation: Narrow supply range (1.14 V–1.26 V) suitable for modern low-voltage system architectures.
  • Commercial Temperature Rating: Rated for 0 °C to 85 °C, aligned with a wide range of commercial applications.

Why Choose LFE3-150EA-8FN672C?

The LFE3-150EA-8FN672C combines substantial programmable logic resources, meaningful on-chip memory, and abundant I/O in a compact 672-BBGA surface-mount package. Its low-voltage operation and commercial temperature rating make it well suited for commercial embedded systems that require a balance of integration and board-space efficiency.

This device is appropriate for designers seeking to consolidate logic, memory, and I/O on a single FPGA to simplify BOM and tighten system integration while maintaining environmental compliance through RoHS alignment.

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