LFE3-17EA-6LMG328C

The LFE3-17EA-6LMG328C is a Lattice ECP3 family FPGA optimized for cost‑sensitive, high‑integration applications. It provides a reconfigurable SRAM fabric built on 65 nm technology, combining 17,000 logic elements, on‑chip memory, DSP resources and configurable I/O to support connectivity and signal processing tasks in commercial systems.

This device targets high‑volume and high‑speed applications where a balance of performance, power efficiency and low system cost is required — for example, communications, video and embedded control designs that need multi‑protocol I/O and programmable logic integration.

Key Features

• Core Logic — 17,000 logic elements for implementing combinational and sequential logic, state machines and glue logic.
• Embedded Memory — Approximately 0.7 Mbits of on‑chip RAM (716,800 total RAM bits) for FIFOs, buffers and local data storage.
• DSP Resources — Dedicated multiply blocks (24 × 18×18 multipliers) and sysDSP architecture for efficient MAC and signal processing operations.
• High‑Speed SERDES — Embedded SERDES support with data rates from 150 Mbps to 3.2 Gbps and package support providing up to 2 SERDES channels in the 328 csBGA (10 × 10 mm) configuration.
• I/O and Interface Flexibility — 116 user I/Os with programmable sysI/O supporting a wide range of standards including LVTTL/LVCMOS (3.3/2.5/1.8/1.5/1.2 V), SSTL, HSTL and differential standards such as LVDS and LVPECL; dedicated DDR memory interfaces with DQS support are also provided.
• Clocking and Timing — On‑device clock management including PLLs and DLLs (PLLs/DLLs = 2/2 for this device) for flexible clocking and timing closure.
• Configuration and Reliability — Flexible device configuration with SPI boot flash interface, dual‑boot image support, TransFR I/O for field updates and embedded soft error detect macros.
• Power and Package — Core supply range of 1.14 V to 1.26 V; surface‑mount 328‑LFBGA (328‑CSBGA, 10 × 10 mm) package; RoHS compliant.
• Commercial Temperature Grade — Operating temperature from 0 °C to 85 °C suitable for commercial applications.

Typical Applications

• Communications & Networking — Implement protocol bridges, line interfaces and SERDES‑based links such as 1 GbE, SGMII and other serialized channels using on‑chip SERDES and flexible I/O.
• Video and Broadcast — Support SMPTE 3G and other video interfaces with embedded SERDES and high‑bandwidth memory buffering.
• Embedded Signal Processing — Use sysDSP slices and 18×18 multipliers for filtering, interpolation, and real‑time DSP tasks in instrumentation and baseband processing.
• Memory Interface & Controller Logic — Implement DDR/DDR2/DDR3‑compatible interfaces with DQS support and on‑chip memory for data buffering and leveling.
• System Glue & Control — Replace discrete logic and microcontroller glue logic with a single programmable device to reduce BOM and accelerate design iteration.

Unique Advantages

• Highly integrated FPGA fabric: Combines 17,000 logic elements, embedded RAM and DSP multipliers to consolidate multiple functions into one device and reduce system complexity.
• Flexible high‑speed I/O: 116 programmable I/Os and SERDES channels enable diverse protocol support and high‑throughput links without external interface chips.
• Configurable boot and field updates: SPI boot, dual‑boot images and TransFR I/O simplify in‑field updates and secure configuration management.
• Commercial‑grade robustness: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial product deployments.
• Efficient DSP capability: sysDSP architecture and multiple 18×18 multipliers accelerate arithmetic‑intensive algorithms while conserving resources.

Why Choose LFE3-17EA-6LMG328C?

The LFE3-17EA-6LMG328C delivers a balanced combination of logic density, on‑chip memory and DSP resources in a compact 328‑CSBGA package, making it a strong choice for commercial systems that require integrated connectivity and signal processing. Its flexible I/O standards, embedded SERDES capability and configurable boot features provide designers the tools to implement interface‑rich, upgradeable products with fewer external components.

This device suits designers and teams developing communication endpoints, video interfaces, embedded controllers and system glue logic who need a programmable, field‑updateable solution with accessible performance and low system cost. Support for proven configuration and clocking features helps reduce design risk and shortens time to market.

Request a quote or submit an inquiry to obtain pricing, availability and additional ordering information for the LFE3-17EA-6LMG328C. Our team can provide part availability and help with volume pricing and lead‑time details.