LFE3-17EA-7FN484I

The LFE3-17EA-7FN484I is a field programmable gate array (FPGA) from the ECP3 family, offering a balance of programmable logic capacity and I/O density in a compact 484-ball BGA package. With 17,000 logic elements and approximately 0.72 Mbits of embedded memory, this device targets embedded and industrial designs that require significant logic resources and high pin-count interfacing.

Key platform characteristics include 222 user I/Os, industrial-grade temperature capability, and a narrow core supply range, enabling deployment in systems that must meet robust operating-environment requirements.

Key Features

• Programmable Logic Capacity — 17,000 logic elements provide substantial on-chip programmable resources for glue logic, custom processing, and protocol implementation.
• Embedded Memory — 716,800 bits of on-chip RAM (approximately 0.72 Mbits) to support FIFOs, buffers, and intermediate data storage without external memory.
• I/O Density — 222 user I/O pins accommodate complex interfacing and multiple simultaneous peripheral connections in a single device.
• Package and Mounting — 484-BBGA (supplier package: 484-FPBGA, 23 × 23 mm) in a surface-mount form factor for compact board integration.
• Core Supply — Operates from a 1.14 V to 1.26 V core supply range, enabling predictable supply design and regulation.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, supporting deployment in industrial and other harsh environments.
• RoHS Compliant — Conforms to RoHS requirements for reduced hazardous substances.

Typical Applications

• Industrial Control and Automation — Industrial-grade operating temperature and rich I/O support sensor aggregation, motor interface logic, and real-time control functions.
• High-Density I/O Bridging — 222 I/Os enable consolidation of multiple interfaces and protocol translation in compact systems.
• Embedded Processing and Glue Logic — 17,000 logic elements and on-chip RAM are suitable for offloading custom processing and system control tasks from processors.
• Communications and Networking Modules — On-chip memory and logic resources facilitate packet buffering, protocol handling, and interface adaptation in networking equipment.

Unique Advantages

• Balanced Logic and Memory: Offers a combination of 17,000 logic elements and ~0.72 Mbits of embedded RAM to support a wide range of mid-density FPGA functions without immediate reliance on external memory.
• High I/O Count: 222 user I/Os reduce the need for external multiplexing or additional devices when integrating multiple peripherals or buses.
• Industrial Reliability: Rated for −40 °C to 100 °C operation, making it suitable for long-term use in industrial environments.
• Compact, Manufacturable Package: 484-ball BGA in a 23 × 23 mm supplier package supports high-density PCB designs while meeting surface-mount assembly workflows.
• Predictable Power Envelope: A defined core voltage range (1.14 V–1.26 V) simplifies power-supply design and sequencing.
• RoHS Compliance: Meets environmental requirements for assemblies targeting global markets concerned with hazardous substance reduction.

Why Choose LFE3-17EA-7FN484I?

The LFE3-17EA-7FN484I positions itself as a capable mid-density FPGA solution for designers who need substantial programmable logic, significant on-chip memory, and a high I/O count in a single, industrial-rated package. Its combination of 17,000 logic elements, approximately 0.72 Mbits of embedded RAM, and 222 I/Os makes it well suited to embedded systems, industrial control, communications modules, and I/O-heavy bridging applications.

Choosing this device supports designs that require a balance of integration, scalability, and environmental robustness while simplifying board-level integration through a compact 484-BBGA surface-mount package and clearly defined supply and thermal specifications.

Request a quote or submit an inquiry to receive pricing and availability for the LFE3-17EA-7FN484I and to discuss how it can fit into your next design.