LFE3-17EA-8FN484C

The LFE3-17EA-8FN484C is an ECP3-series Field Programmable Gate Array (FPGA) in a 484-ball BBGA package, offering a balanced combination of logic capacity, embedded RAM, and I/O density for programmable-logic designs. It is targeted at applications that require programmable integration of custom digital functions, on-chip memory, and extensive external interfacing within a commercial temperature range.

Key Features

• Logic Capacity — Provides 17,000 logic elements, enabling implementation of medium-complexity custom logic and state machines.
• Embedded Memory — Approximately 0.72 Mbits of on-chip RAM (716,800 total bits) for buffering, FIFOs, and small data storage requirements.
• I/O Density — Up to 222 I/O pins to support a wide range of external interfaces and parallel connectivity.
• Package and Mounting — Supplied in a 484-BBGA (484-FPBGA, 23 × 23) package for surface-mount PCB assembly, offering a compact footprint for board-level integration.
• Power — Operates from a 1.14 V to 1.26 V supply range, suitable for designs tuned to low-voltage FPGA cores.
• Operating Temperature — Rated for commercial operation from 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant for lead-free manufacturing processes.

Typical Applications

• Programmable Logic Integration — Implement glue logic, protocol adapters, and custom finite-state machines where flexible on-board logic is required.
• High-Density I/O Systems — Use the 222 I/Os to bridge multiple peripherals, sensors, or parallel buses on a single device.
• Embedded Memory Functions — Leverage approximately 0.72 Mbits of on-chip RAM for buffering, small data queues, and temporary storage within system logic.
• Compact Board Designs — The 484-BBGA package supports compact PCB layouts that require a balance of logic, memory, and I/O in a single component.

Unique Advantages

• Substantial Logic Resources: 17,000 logic elements enable implementation of complex combinational and sequential logic without immediately resorting to larger families.
• Embedded RAM for On-Chip Data Handling: Approximately 0.72 Mbits of RAM reduces dependence on external memory for small buffers and data paths.
• Extensive External Connectivity: 222 I/Os provide flexibility to interface with multiple peripherals, sensors, and parallel buses directly.
• Compact, Surface-Mount Package: The 484-FPBGA (23 × 23) package supports dense PCB designs while maintaining a robust mounting solution.
• Commercial Temperature Rating: Rated 0 °C to 85 °C to match standard commercial electronics deployment environments.
• RoHS Compliance: Meets lead-free manufacturing requirements for modern production workflows.

Why Choose LFE3-17EA-8FN484C?

The LFE3-17EA-8FN484C positions itself as a practical FPGA option for designers needing a mid-range logic element count, meaningful on-chip memory, and a high number of I/Os within a single, surface-mount BBGA package. Its 1.14 V–1.26 V core supply range, commercial temperature rating, and RoHS compliance make it suitable for a wide range of standard embedded and board-level programmable logic applications.

This device is well suited for engineers and procurement teams building compact, integrated designs that require custom logic, interface consolidation, and on-chip buffering while keeping BOM complexity down. The combination of 17,000 logic elements, approximately 0.72 Mbits of embedded RAM, and 222 I/Os offers a solid platform for scalable, reliable system designs.

Request a quote or submit a price inquiry to evaluate the LFE3-17EA-8FN484C for your next programmable-logic design and receive detailed availability and lead-time information.