LFE3-17EA-8FN484I

The LFE3-17EA-8FN484I is an ECP3 family Field Programmable Gate Array (FPGA) offered in a 484-ball BGA package. It provides 17,000 logic elements and approximately 0.717 Mbits of embedded memory, combined with 222 I/O pins to support dense, user-defined digital logic implementations.

Designed for industrial-grade deployments, this surface-mount device supports a core supply range of 1.14 V to 1.26 V and an operating temperature span of −40 °C to 100 °C, addressing systems that require a robust logic fabric with substantial I/O and on-chip memory.

Key Features

• Logic Capacity 17,000 logic elements for implementing custom digital functions, state machines, and protocol logic.
• Embedded Memory Approximately 0.717 Mbits of on-chip RAM to support FIFOs, buffering, small data stores and local scratch memory.
• I/O Density 222 general-purpose I/O pins to connect with multiple peripherals, interfaces, and external logic devices.
• Power Core voltage supply range of 1.14 V to 1.26 V to match system power-rail requirements for the device core.
• Package 484-ball BGA (supplier package: 484-FPBGA, 23 × 23 mm) offering a compact, high-pin-count footprint for PCB integration.
• Thermal and Industrial Grade Rated for industrial operating temperatures from −40 °C to 100 °C, suitable for deployments requiring extended temperature tolerance.
• Mounting Surface-mount device for standard PCBA assembly processes.
• Standards Compliance RoHS compliant for materials and manufacturing processes.

Typical Applications

• Industrial Control Use in control systems and automation equipment where industrial temperature range and reliable I/O density are required.
• Communications and Networking Implementation of protocol logic, data buffering, and interface bridging using ample I/O and on-chip RAM.
• Embedded Systems Custom digital processing, glue logic, and peripheral aggregation for compact embedded designs.
• High-Density I/O Systems Applications requiring numerous external connections benefit from the 222 I/O pins and BGA footprint.

Unique Advantages

• Balanced Logic and Memory The combination of 17,000 logic elements and approximately 0.717 Mbits of embedded RAM supports diverse user logic and local data storage without external memory for many designs.
• High I/O Count 222 I/Os provide flexibility to interface with multiple peripherals, sensors, and high-pin-count connectors, reducing external multiplexing.
• Industrial Temperature Range Rated from −40 °C to 100 °C, enabling deployment in thermally demanding environments.
• Compact, High-Pin Package 484-BBGA (23 × 23 mm) delivers high pin density in a compact footprint for space-constrained boards.
• RoHS Compliant Material compliance simplifies integration into designs targeting restricted-substance requirements.
• Surface-Mount Ready Standard surface-mount form factor suitable for modern PCB assembly and automated production.

Why Choose LFE3-17EA-8FN484I?

The LFE3-17EA-8FN484I positions itself as a versatile FPGA option for design teams seeking a balance of logic density, embedded memory, and substantial I/O in an industrial-grade package. Its combination of 17,000 logic elements, approximately 0.717 Mbits of on-chip RAM, and 222 I/Os makes it well suited to mid-complexity digital designs that require reliable operation across a wide temperature range.

Engineers aiming for scalable, board-level integration will find the compact 484-BBGA footprint and surface-mount mounting well suited to space-constrained and production environments, while RoHS compliance supports regulatory requirements during product development and manufacturing.

Request a quote or submit a part inquiry to check availability and pricing for the LFE3-17EA-8FN484I. Our team can provide lead-time information and assist with order placement.