LFE2M70SE-5F900I

The LFE2M70SE-5F900I is an ECP2M family Field Programmable Gate Array (FPGA) IC designed for industrial applications that require substantial on-chip logic and I/O density. With 67,000 logic elements and approximately 4.64 Mbits of embedded memory, this device targets designs that need extensive programmable logic, significant on-chip storage, and a high pin count interface.

Designed for surface-mount deployment in a 900-ball BGA package, the device operates over an industrial temperature range and supports a narrow core supply window for consistent, controlled power delivery in system designs.

Key Features

• Logic Capacity  67,000 logic elements provide a large fabric for implementing complex custom logic, state machines, and parallel processing blocks.
• Embedded Memory  Approximately 4.64 Mbits of on-chip RAM to support data buffering, packet handling, and intermediate storage without immediate external memory.
• High I/O Count  416 general-purpose I/O pins to support connectivity to multiple peripherals, sensors, or high‑pin-count interfaces.
• Supply Voltage  Core supply range of 1.14 V to 1.26 V to match system power architectures that target low-voltage FPGA cores.
• Package Options  900-ball packaging listed as 900-BBGA and supplier device package 900-FPBGA (31x31), enabling compact, high-density board layouts.
• Industrial Temperature Range  Rated for operation from -40 °C to 100 °C for deployment in industrial environments.
• Surface Mount  Surface-mount device suitable for modern PCB assembly and automated manufacturing processes.
• RoHS Compliant  Conforms to RoHS requirements for reduced hazardous substances.

Typical Applications

• Industrial Control  Use the industrial temperature rating and extensive I/O to interface with sensors and actuators in factory automation and process control systems.
• High‑density I/O Systems  The 416 I/O pins support multi-channel interfacing, large peripheral arrays, or complex board-level routing requirements.
• Memory‑rich Logic Designs  Approximately 4.64 Mbits of embedded memory combined with 67,000 logic elements supports designs that need significant on-chip buffering and state storage.

Unique Advantages

• Substantial Logic Resources: 67,000 logic elements allow implementation of large, custom digital functions without immediate partitioning across multiple devices.
• On‑chip Memory Capacity: Approximately 4.64 Mbits of RAM reduces dependence on external memory for many buffering and temporary storage needs.
• High Connectivity: 416 I/Os provide flexible interfacing options, letting designers consolidate multiple signals and peripherals to a single FPGA.
• Industrial Reliability: Rated for -40 °C to 100 °C, the device supports deployments in temperature-challenging industrial environments.
• Compact High‑ball‑count Package: 900-BBGA / 900-FPBGA (31x31) packaging supports dense PCB routing for space-constrained system designs.
• RoHS Compliance: Meets RoHS requirements for designs where hazardous-material restrictions are required.

Why Choose LFE2M70SE-5F900I?

The LFE2M70SE-5F900I combines a large logic fabric, considerable embedded memory, and a high I/O count in a compact 900-ball BGA package, making it suited to industrial and high‑density system designs that require on‑chip resources and broad connectivity. Its core voltage range and industrial operating temperature provide predictable electrical and environmental behavior for production deployments.

This FPGA is a fit for teams building scalable embedded and industrial systems that need to consolidate logic, reduce external memory dependence, and support many peripheral connections while maintaining RoHS compliance.

Request a quote or submit a procurement inquiry to get pricing and availability information for LFE2M70SE-5F900I.