LFE2M70SE-5F900C

The LFE2M70SE-5F900C is an ECP2M family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It combines significant logic capacity, embedded memory and a high I/O count in a compact surface-mount 900-BBGA package for commercial-grade applications.

With approximately 67,000 logic elements, roughly 4.64 Mbits of embedded memory and 416 user I/O, this device targets designs that require programmable digital logic, on-chip buffering and dense external interfacing while operating within a low-voltage core range.

Key Features

• Logic Capacity  Approximately 67,000 logic elements providing substantial programmable logic resources for custom digital functions.
• Embedded Memory  Approximately 4.64 Mbits of on-chip RAM (4,642,816 bits) for buffering, FIFOs and local data storage.
• I/O Density  416 user I/O pins to support high-pin-count designs and complex external interfacing.
• Package & Mounting  900-BBGA package in supplier device package 900-FPBGA (31×31), designed for surface-mount assembly.
• Power  Core voltage supply range of 1.14 V to 1.26 V to match low-voltage system architectures.
• Temperature & Grade  Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High‑density I/O systems  Suitable for designs that require many external interfaces, leveraging the 416 available I/O pins for sensors, peripherals and board-level interconnects.
• Embedded buffering and data paths  On-chip memory (approximately 4.64 Mbits) supports local buffering and intermediate data storage for streaming or packetized data.
• Custom programmable logic  Approximately 67,000 logic elements enable implementation of tailored digital functions, protocol bridges and glue logic within a single device.

Unique Advantages

• High integration of logic and memory: Combines sizable logic resources with on-chip RAM to reduce the need for external components and simplify board design.
• Extensive I/O capability: 416 I/O pins provide flexibility for complex interfacing requirements and multi-device systems.
• Compact BBGA footprint: 900-BBGA (900-FPBGA, 31×31) delivers a high pin count in a compact surface-mount form factor for dense PCBs.
• Low-voltage core operation: 1.14 V to 1.26 V supply range aligns with modern low-voltage digital systems.
• Commercial temperature and RoHS compliance: Designed for commercial-temperature environments (0 °C to 85 °C) and meets RoHS requirements for environmental compliance.

Why Choose LFE2M70SE-5F900C?

The LFE2M70SE-5F900C positions itself as a balanced solution for designs that need a combination of programmable logic, significant on-chip memory and a high count of I/O in a compact surface-mount package. Its approximately 67,000 logic elements, roughly 4.64 Mbits of embedded RAM and 416 I/O pins make it suitable for projects that require integration of multiple digital functions while minimizing external components.

Engineers and procurement teams seeking a commercial-grade FPGA with a 900-BBGA footprint, low-voltage operation and RoHS compliance will find this device appropriate for scalable, board-level implementations where dense I/O and local memory are priorities.

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