LFE2M70E-7FN1152C

The LFE2M70E-7FN1152C is a field programmable gate array (FPGA) from Lattice Semiconductor Corporation, offering a high-density programmable logic fabric. It provides 67,000 logic elements, approximately 4.64 Mbits of embedded memory, and 436 user I/Os in a compact 1152‑BBGA package.

Designed for applications that require dense logic capacity, ample on-chip RAM and a large I/O complement, this commercial-grade FPGA operates from a 1.14 V to 1.26 V supply and across a 0°C to 85°C temperature range.

Key Features

• Core Logic  67,000 logic elements to implement complex, high-density digital designs.
• Embedded Memory  Approximately 4.64 Mbits of on-chip RAM for buffering, state storage and data path implementation.
• I/O Density  436 user I/Os to support broad interfacing and parallel connectivity requirements.
• Power  Operates from a 1.14 V to 1.26 V supply range, enabling low-voltage system integration.
• Package & Mounting  1152‑BBGA package (supplier device package: 1152‑FPBGA, 35×35) with surface-mount mounting for compact board-level integration.
• Operating Grade  Commercial grade operation over a 0°C to 85°C ambient temperature range.
• Compliance  RoHS compliant.

Typical Applications

• High‑density logic integration  Use the 67,000 logic elements to consolidate multiple functions into a single programmable device.
• On‑chip buffering and data handling  Approximately 4.64 Mbits of embedded memory supports data staging, FIFOs and state storage within the FPGA.
• Multi‑interface bridging  436 I/Os provide the signal count needed for wide parallel buses, peripheral aggregation and interface conversion.
• Compact board designs  1152‑BBGA surface-mount packaging enables high-density PCB layouts where board space is constrained.

Unique Advantages

• High logic capacity: 67,000 logic elements allow integration of complex control, signal processing and glue‑logic into a single device, reducing board-level components.
• Substantial on-chip RAM: Approximately 4.64 Mbits of embedded memory minimizes external memory needs for many buffering and stateful functions.
• Extensive I/O resources: 436 I/Os simplify system-level connectivity and reduce the need for external I/O expanders.
• Low-voltage operation: 1.14 V to 1.26 V supply range supports modern low-voltage system architectures and power management schemes.
• Compact package: 1152‑BBGA (35×35 FPBGA) supports dense PCB integration while maintaining high pin count.
• RoHS compliance: Environmentally compliant manufacturing and materials.

Why Choose LFE2M70E-7FN1152C?

The LFE2M70E-7FN1152C positions itself as a high-density, commercially graded FPGA option for designs that need substantial logic resources, on-chip memory and a large number of I/Os in a compact surface-mount package. Its combination of 67,000 logic elements, approximately 4.64 Mbits of embedded RAM and 436 I/Os makes it suitable for consolidating multiple functions and reducing system BOM.

Backed by Lattice Semiconductor Corporation, this device provides a scalable building block for engineers seeking to implement complex programmable logic within typical commercial temperature and voltage environments.

Request a quote or submit a quote request for LFE2M70E-7FN1152C to receive pricing and availability information.