LFE2M50SE-7F672C
| Part Description |
ECP2M Field Programmable Gate Array (FPGA) IC 372 4246528 48000 672-BBGA |
|---|---|
| Quantity | 1,227 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FPBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 372 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6000 | Number of Logic Elements/Cells | 48000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4246528 |
Overview of LFE2M50SE-7F672C – ECP2M FPGA, 48,000 logic elements, 372 I/Os, 672-BBGA
The LFE2M50SE-7F672C is a commercial‑grade FPGA from Lattice Semiconductor’s ECP2M family, delivering a high‑integration programmable fabric for system and communications designs. This device combines 48,000 logic elements with approximately 4.25 Mbits of embedded memory, 372 general‑purpose I/Os and a 672‑ball BGA package (27 × 27 mm), making it suitable for designs that require dense logic, on‑chip memory and flexible I/O in a compact surface‑mount footprint.
Operating from a low‑voltage core supply of 1.14 V to 1.26 V and rated for 0 °C to 85 °C, the device targets commercial applications where platform integration, configurable logic and vendor tool support are required.
Key Features
- Logic Capacity — 48,000 logic elements for implementing complex state machines, glue logic and datapath functions.
- Embedded Memory — Total on‑chip RAM of 4,246,528 bits (approximately 4.25 Mbits) for frame buffers, FIFOs and local storage.
- I/O Density & Package — 372 I/Os in a 672‑ball BBGA (27 × 27 mm) surface‑mount package to support dense board routing and multi‑bank interface requirements.
- Power — Low‑voltage core supply range of 1.14 V to 1.26 V to match modern low‑power system rails.
- Commercial Temperature Grade — Rated for 0 °C to 85 °C suitable for commercial application deployments.
- Family‑Level SerDes & DSP — As part of the LatticeECP2M family, devices in this family offer embedded high‑speed SERDES and advanced sysDSP blocks for communication and signal processing tasks (family feature).
- Clocking & Timing — The ECP2M family includes GPLLs, SPLLs and DLLs for flexible clock management (family feature).
- Configurable I/O Standards — Family supports a wide range of I/O standards and source‑synchronous interfaces for memory and high‑speed peripherals (family feature).
- RoHS Compliant — Device is RoHS compliant for environmental and regulatory alignment.
Typical Applications
- Networking & Telecom — Implement protocol bridges, packet buffering and SERDES‑based serial links (family SERDES capabilities support common interfaces).
- High‑performance Embedded Systems — On‑chip memory and DSP resources enable local data processing, filtering and custom accelerators.
- Interface & Glue Logic — High I/O count and programmable I/O standards make the device suitable for complex board‑level interfacing and system integration.
- Data Acquisition & Conversion — Use embedded memory and DSP fabric for streaming data capture, buffering and preprocessing from ADCs/DACs (leveraging family DSP and source‑synchronous I/O features).
Unique Advantages
- High Integration in a Compact Package: 48,000 logic elements and ~4.25 Mbits of embedded RAM in a 27 × 27 mm 672‑ball BGA reduce external components and board area.
- Flexible I/O Capacity: 372 I/Os provide the channel count needed for multi‑bank interfaces, peripheral expansion and parallel buses.
- Low‑Voltage Core: 1.14–1.26 V supply supports modern low‑power system rails and power management strategies.
- Commercial‑Grade Reliability: 0 °C to 85 °C rating and RoHS compliance align the device with standard commercial deployments and environmental requirements.
- Family Ecosystem: Benefits from Lattice ECP2M family features—embedded SERDES, sysDSP blocks, flexible clocking and configurable I/O—plus vendor design tool support for implementation and debugging (family feature).
Why Choose LFE2M50SE-7F672C?
The LFE2M50SE-7F672C positions itself as a versatile, commercially graded FPGA for system designers who need significant logic capacity, substantial embedded memory and a high I/O count in a compact BGA package. Its low‑voltage core, RoHS compliance and alignment with the Lattice ECP2M family feature set make it well suited to communications, embedded processing and interface‑dense applications.
For teams seeking a scalable FPGA option backed by family‑level features such as high‑speed serial connectivity, DSP resources and flexible clocking, this device provides a balance of integration and configurability while fitting standard commercial operating environments.
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