LFE2M50SE-6F672I

The LFE2M50SE-6F672I is an ECP2M Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It provides a combination of logic capacity, on-chip memory and I/O density in a 672-ball BGA package.

Designed for industrial-grade deployments, this device offers 48,000 logic elements, approximately 4.25 Mbits of embedded memory, and 372 I/O, with a specified operating temperature range of −40°C to 100°C and a nominal supply range of 1.14 V to 1.26 V.

Key Features

• Logic Capacity  48,000 logic elements to implement complex digital functions and custom logic architectures.
• Embedded Memory  Approximately 4.25 Mbits of on-chip RAM to support buffering, state storage and local data processing.
• I/O Density  372 I/O pins for extensive peripheral and system interfacing.
• Package & Mounting  672-BBGA package, supplier device package 672-FPBGA (27×27), designed for surface-mount assembly.
• Power  Specified supply voltage range from 1.14 V to 1.26 V for core power planning.
• Industrial Temperature Range  Rated for operation from −40°C to 100°C, suitable for industrial-temperature applications.
• Compliance  RoHS compliant.

Typical Applications

• High-density I/O systems  Leverage 372 I/O pins for complex sensor arrays, multi-channel interfaces or extensive peripheral connectivity.
• Memory-backed logic  Use the approximately 4.25 Mbits of embedded memory for buffering, packet processing or local data storage in real-time designs.
• Industrial equipment  Deploy in equipment that requires industrial temperature range operation (−40°C to 100°C) and surface-mount BGA packaging.
• Compact board-level solutions  The 672-BBGA (672-FPBGA, 27×27) package supports dense integration on compact PCBs.

Unique Advantages

• Balanced logic and memory  Combines 48,000 logic elements with approximately 4.25 Mbits of embedded RAM to support both control logic and local data storage on a single device.
• High I/O count  372 I/O pins reduce the need for external multiplexing or expanders in I/O-heavy system designs.
• Industrial temperature rating  Operation from −40°C to 100°C supports deployment in demanding environmental conditions.
• Compact BGA packaging  672-BBGA (672-FPBGA, 27×27) surface-mount package enables high-density board layouts and reliable soldered connections.
• Defined core voltage range  A clear supply window (1.14 V to 1.26 V) simplifies power supply selection and margin planning.

Why Choose LFE2M50SE-6F672I?

The LFE2M50SE-6F672I positions itself as a tightly integrated FPGA option within the ECP2M family, offering a substantial mix of logic, embedded memory and I/O in an industrial-grade package. Its combination of 48,000 logic elements, approximately 4.25 Mbits of RAM and 372 I/O makes it suitable for designs that require on-chip resources and robust thermal performance.

Ideal for engineers and procurement teams working on industrial or board-level systems that need a balance of capacity, I/O density and compact packaging, this FPGA supports scalable implementations while meeting standard RoHS compliance.

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