LFE2M50SE-6F672C

The LFE2M50SE-6F672C is an ECP2M Field Programmable Gate Array (FPGA) supplied in a 672-ball BGA package. It integrates 48,000 logic elements, approximately 4.246528 Mbits of on-chip RAM, and 372 user I/O pins, providing a configurable platform for medium-density programmable logic implementations.

Designed for commercial-grade deployments, the device is surface-mount compatible, RoHS compliant, and operates from a core supply range of 1.14 V to 1.26 V with an ambient operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic 48,000 logic elements to implement medium-density programmable logic and custom digital functions.
• Embedded Memory Approximately 4.246528 Mbits of on-chip RAM for local buffering, state storage, and data handling.
• I/O Capacity 372 available I/O pins to support wide-ranging interfacing and signal routing requirements.
• Power Core voltage supply range of 1.14 V to 1.26 V to match system power domains.
• Package & Mounting 672-BBGA package (supplier device package: 672-FPBGA, 27 × 27 mm) in a surface-mount form factor for compact board-level integration.
• Temperature & Grade Commercial grade operation from 0 °C to 85 °C suitable for standard commercial applications.
• Compliance RoHS compliant for adherence to common environmental and material requirements.

Typical Applications

• Programmable Digital Logic Implement medium-density customized digital functions where 48,000 logic elements provide the required logic fabric.
• High‑I/O Interface Bridging Use the 372 I/O pins to connect and bridge multiple peripherals, buses, or external devices on compact PCBs.
• On‑chip Data Buffering and State Storage Leverage approximately 4.246528 Mbits of embedded RAM for local buffering, FIFOs, and state machines.

Unique Advantages

• Substantial Logic Density: 48,000 logic elements enable complex logic implementation without external ASICs.
• Significant On‑Chip Memory: Approximately 4.246528 Mbits of embedded RAM reduces reliance on external memory components.
• High Pin Count in Compact Package: 372 I/O in a 672‑BBGA (27 × 27 mm) lets designers achieve high connectivity in a compact form factor.
• Controlled Power Domain: Narrow core voltage range (1.14 V–1.26 V) simplifies power-supply planning for the FPGA core.
• Commercial Temperature Range: Operation from 0 °C to 85 °C suits a wide range of standard commercial product use cases.
• RoHS Compliant: Conforms to common environmental material requirements for easier regulatory alignment.

Why Choose LFE2M50SE-6F672C?

The LFE2M50SE-6F672C delivers a balanced combination of logic capacity, embedded memory, and I/O density in a compact 672‑ball BGA package, making it well suited for commercial applications that require configurable digital logic and substantial on-chip resources. Its electrical and thermal specifications provide predictable integration into standard commercial designs.

This FPGA is appropriate for designers and teams who need medium-density programmable logic with integrated RAM and a high I/O count, while maintaining RoHS compliance and conventional operating temperature limits. It offers scalability within programmable designs and straightforward board-level integration thanks to its surface-mount BGA packaging.

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