LFE2M50SE-5FN672C

The LFE2M50SE-5FN672C is an ECP2M family field programmable gate array from Lattice Semiconductor Corporation. This commercial-grade, surface-mount FPGA integrates 48,000 logic elements and approximately 4.25 Mbits of embedded memory to support medium-density programmable logic designs.

With 372 available I/Os, a 672-ball BGA package (672-FPBGA, 27×27), a core supply range of 1.14–1.26 V, and an operating temperature range of 0 °C to 85 °C, the device is targeted at systems requiring high I/O density and configurable logic in a compact package. RoHS compliance is included.

Key Features

• Logic Capacity — Provides 48,000 logic elements for implementing custom digital logic and state machines; the device reports 6,000 logic blocks.
• Embedded Memory — Approximately 4.25 Mbits of on-chip RAM for buffering, FIFOs, and local data storage to support complex designs.
• I/O Density — 372 user I/Os to support multiple interfaces, parallel buses, and mixed-signal front-end connections in a single device.
• Package & Mounting — 672-ball BGA (supplier package: 672-FPBGA, 27×27) in a surface-mount form factor for compact system integration.
• Power — Core voltage supply range from 1.14 V to 1.26 V for defined power planning in system design.
• Operating Range & Grade — Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Protocol Bridging and Interface Aggregation — High I/O count enables concentration of multiple serial and parallel interfaces for board-level protocol conversion and glue logic.
• Custom Logic and Control — 48,000 logic elements support implementation of custom finite-state machines, control logic, and peripheral controllers.
• Data Buffering and Local Memory — Approximately 4.25 Mbits of embedded RAM provide on-chip buffering for packet handling, streaming data, and temporary storage.

Unique Advantages

• Balanced Logic and Memory Combination: The mix of 48,000 logic elements and ~4.25 Mbits of RAM allows designers to implement both complex combinational/sequential logic and sizable on-chip buffering without external memory for many use cases.
• High I/O Count: 372 I/Os reduce the need for external I/O expanders and simplify board-level routing for multi-interface systems.
• Compact BGA Packaging: The 672-BBGA (672-FPBGA, 27×27) provides high pin density in a surface-mount form factor, helping to save PCB area in space-constrained designs.
• Defined Power Envelope: A narrow core voltage range (1.14–1.26 V) aids predictable power-supply design and thermal planning.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C operation to suit a wide range of commercial and consumer applications.
• RoHS Compliant: Meets environmental regulations for restricted substances.

Why Choose LFE2M50SE-5FN672C?

The LFE2M50SE-5FN672C positions itself as a versatile, medium-density FPGA solution that combines substantial logic capacity, embedded memory, and a high I/O count in a compact BGA package. Its electrical and thermal specifications are defined for commercial systems where board area, I/O integration, and on-chip memory are important design drivers.

This part is suitable for designers seeking a programmable device to consolidate interface logic, implement custom control and data-path functions, and reduce component count while maintaining clear electrical supply and temperature parameters. RoHS compliance and standard surface-mount packaging support integration into mainstream manufacturing flows.

Request a quote or submit a procurement inquiry to obtain pricing, availability, and lead-time information for the LFE2M50SE-5FN672C.