LFE2M50SE-5FN484C

IC FPGA 270 I/O 484FBGA
Part Description

ECP2M Field Programmable Gate Array (FPGA) IC 270 4246528 48000 484-BBGA

Quantity 1,120 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O270Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6000Number of Logic Elements/Cells48000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4246528

Overview of LFE2M50SE-5FN484C – ECP2M FPGA, 48,000 Logic Elements, approximately 4.25 Mbit RAM, 270 I/Os, 484-BBGA

The LFE2M50SE-5FN484C is a Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation’s ECP2M family. It provides a balance of programmable logic capacity, on-chip memory and a high I/O count in a compact surface-mount package.

Targeted for commercial-grade designs, this device integrates 48,000 logic elements, approximately 4.25 Mbits of embedded memory, and 270 user I/Os, and operates from a 1.14 V to 1.26 V supply across a 0 °C to 85 °C temperature range.

Key Features

  • Core Logic 48,000 logic elements provide substantial programmable logic capacity for complex combinational and sequential designs.
  • Logic Clusters 6,000 CLB-like logic clusters (as reported) to structure design implementation and resource allocation.
  • Embedded Memory Approximately 4.25 Mbits of on-chip RAM for buffering, FIFOs and local data storage without external memory.
  • I/O Count 270 user I/Os to support multiple parallel interfaces and peripheral connections.
  • Package 484-ball BBGA surface-mount package (supplier device package: 484-FPBGA, 23×23) for high-density board integration.
  • Power Narrow core supply range of 1.14 V to 1.26 V to match system power rails and enable predictable power budgeting.
  • Operating Range Commercial-grade operating temperature from 0 °C to 85 °C suitable for a wide range of commercial applications.
  • Environmental Compliance RoHS compliant to meet common environmental and assembly requirements.

Typical Applications

  • Commercial Embedded Systems Implement custom digital logic, control functions and interface glue logic in commercial products.
  • I/O-Intensive Control Use the 270 I/Os to manage multiple sensors, actuators or peripheral buses in medium-complexity systems.
  • Prototyping and Development Leverage the sizable logic and on-chip RAM capacity to validate system-level designs and iterate hardware-in-the-loop testing.

Unique Advantages

  • Substantial Logic Capacity: 48,000 logic elements allow implementation of sizeable custom logic blocks without immediately requiring larger devices.
  • Ample On-Chip Memory: Approximately 4.25 Mbits of embedded RAM reduces dependence on external memory for buffering and local data storage.
  • High I/O Density: 270 user I/Os provide flexibility for multi-interface and multi-peripheral designs, minimizing additional interface components.
  • Compact Surface-Mount Package: 484-BBGA (23×23) package enables a compact PCB footprint while supporting high pin count requirements.
  • Commercial Grade and RoHS Compliant: Rated for 0 °C to 85 °C operation and RoHS compliant for assembly and regulatory alignment in commercial products.
  • Narrow Core Voltage Window: Defined supply range (1.14 V to 1.26 V) helps simplify power-supply selection and system power planning.

Why Choose LFE2M50SE-5FN484C?

The LFE2M50SE-5FN484C positions itself as a versatile commercial-grade FPGA that combines a large logic fabric, substantial embedded memory and a high I/O count in a compact 484-BBGA package. These attributes make it suitable for commercial embedded designs that require on-chip resources and dense interfacing while maintaining a small PCB footprint.

For design teams and procurers focused on scalability and predictable integration, this device delivers clear capacity metrics—logic elements, memory size, I/O count, package and operating limits—allowing straightforward evaluation against system requirements.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the LFE2M50SE-5FN484C.

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