LFE2M50SE-5FN484C
| Part Description |
ECP2M Field Programmable Gate Array (FPGA) IC 270 4246528 48000 484-BBGA |
|---|---|
| Quantity | 1,120 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 270 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6000 | Number of Logic Elements/Cells | 48000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4246528 |
Overview of LFE2M50SE-5FN484C – ECP2M FPGA, 48,000 Logic Elements, approximately 4.25 Mbit RAM, 270 I/Os, 484-BBGA
The LFE2M50SE-5FN484C is a Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation’s ECP2M family. It provides a balance of programmable logic capacity, on-chip memory and a high I/O count in a compact surface-mount package.
Targeted for commercial-grade designs, this device integrates 48,000 logic elements, approximately 4.25 Mbits of embedded memory, and 270 user I/Os, and operates from a 1.14 V to 1.26 V supply across a 0 °C to 85 °C temperature range.
Key Features
- Core Logic 48,000 logic elements provide substantial programmable logic capacity for complex combinational and sequential designs.
- Logic Clusters 6,000 CLB-like logic clusters (as reported) to structure design implementation and resource allocation.
- Embedded Memory Approximately 4.25 Mbits of on-chip RAM for buffering, FIFOs and local data storage without external memory.
- I/O Count 270 user I/Os to support multiple parallel interfaces and peripheral connections.
- Package 484-ball BBGA surface-mount package (supplier device package: 484-FPBGA, 23×23) for high-density board integration.
- Power Narrow core supply range of 1.14 V to 1.26 V to match system power rails and enable predictable power budgeting.
- Operating Range Commercial-grade operating temperature from 0 °C to 85 °C suitable for a wide range of commercial applications.
- Environmental Compliance RoHS compliant to meet common environmental and assembly requirements.
Typical Applications
- Commercial Embedded Systems Implement custom digital logic, control functions and interface glue logic in commercial products.
- I/O-Intensive Control Use the 270 I/Os to manage multiple sensors, actuators or peripheral buses in medium-complexity systems.
- Prototyping and Development Leverage the sizable logic and on-chip RAM capacity to validate system-level designs and iterate hardware-in-the-loop testing.
Unique Advantages
- Substantial Logic Capacity: 48,000 logic elements allow implementation of sizeable custom logic blocks without immediately requiring larger devices.
- Ample On-Chip Memory: Approximately 4.25 Mbits of embedded RAM reduces dependence on external memory for buffering and local data storage.
- High I/O Density: 270 user I/Os provide flexibility for multi-interface and multi-peripheral designs, minimizing additional interface components.
- Compact Surface-Mount Package: 484-BBGA (23×23) package enables a compact PCB footprint while supporting high pin count requirements.
- Commercial Grade and RoHS Compliant: Rated for 0 °C to 85 °C operation and RoHS compliant for assembly and regulatory alignment in commercial products.
- Narrow Core Voltage Window: Defined supply range (1.14 V to 1.26 V) helps simplify power-supply selection and system power planning.
Why Choose LFE2M50SE-5FN484C?
The LFE2M50SE-5FN484C positions itself as a versatile commercial-grade FPGA that combines a large logic fabric, substantial embedded memory and a high I/O count in a compact 484-BBGA package. These attributes make it suitable for commercial embedded designs that require on-chip resources and dense interfacing while maintaining a small PCB footprint.
For design teams and procurers focused on scalability and predictable integration, this device delivers clear capacity metrics—logic elements, memory size, I/O count, package and operating limits—allowing straightforward evaluation against system requirements.
Request a quote or submit an inquiry for pricing and availability to move your design forward with the LFE2M50SE-5FN484C.

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