LFE2M50SE-5F900C

IC FPGA 410 I/O 900FBGA
Part Description

ECP2M Field Programmable Gate Array (FPGA) IC 410 4246528 48000 900-BBGA

Quantity 657 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package900-FPBGA (31x31)GradeCommercialOperating Temperature0°C – 85°C
Package / Case900-BBGANumber of I/O410Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6000Number of Logic Elements/Cells48000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4246528

Overview of LFE2M50SE-5F900C – ECP2M FPGA, 48,000 logic elements, 410 I/O, 900-BBGA

The LFE2M50SE-5F900C is an ECP2M Field Programmable Gate Array (FPGA) IC designed for commercial applications requiring substantial programmable logic capacity and high I/O density. It combines 48,000 logic elements, approximately 4.25 Mbits of on-chip RAM, and up to 410 I/O in a compact 900‑BBGA (900‑FPBGA, 31×31) surface-mount package.

With a 1.14 V to 1.26 V supply range, commercial temperature rating (0 °C to 85 °C), and RoHS compliance, this device is tailored for designers seeking a high-density, low-voltage programmable platform in space-efficient packaging.

Key Features

  • Core Logic  48,000 logic elements provide substantial programmable fabric for mid-to-high density digital designs.
  • Logic Block Structure  6,000 logic blocks support organized implementation of complex logic functions.
  • Embedded Memory  Approximately 4.25 Mbits of on-chip RAM for buffering, lookup tables, and state storage without external memory.
  • I/O Density  Up to 410 I/O pins enable wide interfacing options for parallel buses, peripherals, and system-level integration.
  • Power  Low-voltage operation with a supply range of 1.14 V to 1.26 V to support power-conscious designs.
  • Package & Mounting  900‑BBGA (supplier package: 900‑FPBGA, 31×31) in a surface-mount form factor for compact board layouts.
  • Temperature & Grade  Commercial grade operation from 0 °C to 85 °C for standard commercial product environments.
  • Environmental Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Unique Advantages

  • High-density programmable fabric: 48,000 logic elements enable complex logic integration on a single device, reducing external components.
  • Substantial on-chip RAM: Approximately 4.25 Mbits of embedded memory lowers dependence on external memory for many designs.
  • Very high I/O count: 410 I/O pins provide flexibility for interfacing multiple peripherals, sensors, and buses.
  • Compact high-pin package: 900‑BBGA (31×31) delivers high pin count in a space-efficient surface-mount footprint.
  • Low-voltage operation: 1.14 V to 1.26 V supply supports designs targeting reduced power consumption.
  • Commercial availability with RoHS: Commercial temperature grade and RoHS compliance enable standard commercial deployments and manufacturing flows.

Why Choose LFE2M50SE-5F900C?

The LFE2M50SE-5F900C is positioned for designers who need a dense, on-chip programmable solution with significant logic capacity, embedded memory, and a high number of I/O in a compact package. Its combination of 48,000 logic elements, approximately 4.25 Mbits of RAM, and 410 I/O makes it well suited to commercial applications requiring integration and board-space efficiency.

With a low-voltage supply window, surface-mount 900‑BBGA package, commercial temperature rating, and RoHS compliance, this FPGA offers a practical balance of performance and manufacturability for commercial embedded and system-level designs.

Request a quote or submit an inquiry to receive pricing and availability information for LFE2M50SE-5F900C.

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