LFE2M50SE-5F484I

The LFE2M50SE-5F484I is an ECP2M field programmable gate array (FPGA) IC offering 48,000 logic elements, approximately 4.25 Mbits of embedded memory, and up to 270 I/O pins in a 484-ball BGA footprint. It is specified for industrial-grade applications, supporting a wide operating temperature range and a tightly defined core voltage window.

This device targets designs that require significant on-chip logic capacity, substantial embedded RAM, and high I/O density while maintaining industrial temperature and mounting requirements.

Key Features

• Logic Capacity — 48,000 logic elements to implement mid-to-high complexity digital designs and custom logic functions.
• Embedded Memory — Total on-chip RAM of 4,246,528 bits, or approximately 4.25 Mbits of embedded memory for buffers, FIFOs and local storage.
• I/O Density — Up to 270 I/O pins to support multiple interfaces and parallel connectivity options.
• Power Supply — Core voltage range from 1.14 V to 1.26 V for defined low-voltage operation.
• Package & Mounting — 484-ball BGA package (supplier device package: 484-FPBGA, 23×23) in a surface-mount form factor for compact board designs.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet industrial environmental requirements.
• RoHS Compliant — Conforms to RoHS requirements for lead-free manufacturing.

Typical Applications

• Industrial Control & Automation — Implements control logic, timing, and I/O aggregation in factory automation equipment within industrial temperature ranges.
• High-Density I/O Systems — Serves as an interface hub or protocol bridge where a large number of I/Os and flexible logic are required.
• Embedded Signal Processing — Provides on-chip logic and memory for implementing processing pipelines, buffering, and custom data paths in embedded platforms.
• Custom Hardware Acceleration — Enables hardware-accelerated functions and offloading of compute tasks in industrial-grade systems.

Unique Advantages

• Substantial Logic Resources: 48,000 logic elements enable complex finite-state machines, datapaths, and control logic without external gate arrays.
• Meaningful On-Chip Memory: Approximately 4.25 Mbits of embedded RAM reduces dependence on external memory for many buffering and scratch-pad needs.
• High I/O Count: 270 I/Os support multiple interfaces and parallel buses, simplifying system partitioning and reducing external glue logic.
• Industrial Qualification: Rated −40 °C to 100 °C, making it suitable for extended-temperature deployments in industrial environments.
• Compact, Surface-Mount Packaging: 484-ball BGA (23×23) provides a dense package for space-constrained PCBs while enabling reliable board-level assembly.
• Low-Voltage Core: Defined 1.14 V–1.26 V supply range supports controlled power design and integration with modern power rails.

Why Choose LFE2M50SE-5F484I?

The LFE2M50SE-5F484I positions itself as a capable industrial-grade FPGA combining significant logic density, multiple megabits of embedded memory, and a high I/O count in a compact 484-BBGA package. Its defined voltage and temperature specifications make it a practical choice for engineering teams designing robust embedded and industrial systems that need on-chip resources and reliable operation.

This device is suitable for developers and system architects who require a balance of integration, I/O flexibility, and on-chip memory to reduce external components, simplify board design, and accelerate time-to-market while operating within industrial environmental bounds.

Request a quote or submit a pricing inquiry to evaluate the LFE2M50SE-5F484I for your next design project.