LFE2M50E-7FN672C
| Part Description |
ECP2M Field Programmable Gate Array (FPGA) IC 372 4246528 48000 672-BBGA |
|---|---|
| Quantity | 885 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FPBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 372 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6000 | Number of Logic Elements/Cells | 48000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4246528 |
Overview of LFE2M50E-7FN672C – ECP2M Field Programmable Gate Array (FPGA) IC 372 4246528 48000 672-BBGA
The LFE2M50E-7FN672C is a commercial-grade Lattice ECP2M family FPGA in a 672-ball BBGA package. It delivers a high-density programmable fabric with approximately 48,000 logic elements, roughly 4.25 Mbits of embedded memory, and 372 user I/O pins for system-level integration.
Designed for applications that require embedded memory, DSP-capable fabric and high-speed serial interfaces at low supply voltage, this surface-mount FPGA balances integration and efficiency for communications, industrial controls, and general embedded systems operating across a commercial temperature range.
Key Features
- Logic Capacity Approximately 48,000 logic elements to implement complex logic, glue logic, and protocol handling in a single device.
- Embedded Memory Approximately 4.25 Mbits of on-chip RAM (total RAM bits: 4,246,528) for frame buffering, lookup tables and local data storage.
- I/O Resources 372 user I/O pins support a wide range of interfacing options and system expansion while simplifying PCB routing with a 672-ball fpBGA footprint.
- High-Speed Serial (Family Capability) The LatticeECP2M family supports embedded SERDES with data rates from 250 Mbps to 3.125 Gbps, enabling common serial protocols and chip-to-chip links (family-level feature).
- DSP and Memory Architecture (Family Capability) The family includes sysDSP blocks and flexible embedded block RAM options to accelerate multiply/accumulate and memory-intensive functions (series-level capability).
- Power and Supply Low-voltage core operation with a supply range of 1.14 V to 1.26 V helps reduce system power for energy-conscious designs.
- Package & Mounting 672-BBGA (672-FPBGA, 27 × 27 mm) surface-mount package provides a compact, high-pin-count option for dense system integration.
- Commercial Grade & Environmental Commercial operating temperature of 0 °C to 85 °C and RoHS-compliant construction for supply-chain and regulatory consistency.
Typical Applications
- High-speed communications Use the family’s SERDES capabilities and dense logic to implement Ethernet, PCIe, or other high-speed link endpoints and protocol bridges.
- Embedded networking and connectivity On-chip memory and plentiful I/O simplify packet buffering, interface bridging and system glue logic for network appliances and infrastructure modules.
- Signal processing and DSP acceleration Leverage the family’s sysDSP blocks and embedded RAM for filter, transform, and real-time processing tasks in instrumentation or communications equipment.
- Interface and protocol conversion Implement custom transceivers, protocol handlers and multi-standard interface logic using abundant logic elements and I/O resources.
Unique Advantages
- High integration density: Consolidate multiple discrete functions into a single FPGA with approximately 48,000 logic elements and extensive on-chip memory.
- Scalable serial connectivity (family-level): Embedded SERDES support up to 3.125 Gbps for modern serial protocols and board-level high-speed links.
- Compact, high-pin-count package: 672-ball fpBGA (27 × 27 mm) provides extensive I/O in a compact footprint to reduce board area and simplify routing.
- Low-voltage core: 1.14–1.26 V supply enables lower core power consumption compared to higher-voltage alternatives.
- Commercial readiness: RoHS-compliant and rated for 0 °C to 85 °C operation to match common embedded and communications product environments.
Why Choose LFE2M50E-7FN672C?
The LFE2M50E-7FN672C combines a high logic element count, multi-megabit embedded memory and abundant I/O in a compact 672-ball fpBGA package, making it well suited for designs that demand integration of protocol handling, buffering and DSP-like functions. Its low-voltage core and family-level support for high-speed serial interfaces give designers options to balance power, performance and connectivity.
This device is ideal for teams developing communications modules, embedded networking hardware, and processing-intensive control systems who need a commercially graded FPGA backed by the Lattice ECP2M family architecture and features.
If you would like pricing, availability or to request a quote for LFE2M50E-7FN672C, submit an inquiry or request a quote through your preferred procurement channel.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
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