LFE2M50E-7FN672C

IC FPGA 372 I/O 672FPBGA
Part Description

ECP2M Field Programmable Gate Array (FPGA) IC 372 4246528 48000 672-BBGA

Quantity 885 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package672-FPBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O372Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6000Number of Logic Elements/Cells48000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4246528

Overview of LFE2M50E-7FN672C – ECP2M Field Programmable Gate Array (FPGA) IC 372 4246528 48000 672-BBGA

The LFE2M50E-7FN672C is a commercial-grade Lattice ECP2M family FPGA in a 672-ball BBGA package. It delivers a high-density programmable fabric with approximately 48,000 logic elements, roughly 4.25 Mbits of embedded memory, and 372 user I/O pins for system-level integration.

Designed for applications that require embedded memory, DSP-capable fabric and high-speed serial interfaces at low supply voltage, this surface-mount FPGA balances integration and efficiency for communications, industrial controls, and general embedded systems operating across a commercial temperature range.

Key Features

  • Logic Capacity  Approximately 48,000 logic elements to implement complex logic, glue logic, and protocol handling in a single device.
  • Embedded Memory  Approximately 4.25 Mbits of on-chip RAM (total RAM bits: 4,246,528) for frame buffering, lookup tables and local data storage.
  • I/O Resources  372 user I/O pins support a wide range of interfacing options and system expansion while simplifying PCB routing with a 672-ball fpBGA footprint.
  • High-Speed Serial (Family Capability)  The LatticeECP2M family supports embedded SERDES with data rates from 250 Mbps to 3.125 Gbps, enabling common serial protocols and chip-to-chip links (family-level feature).
  • DSP and Memory Architecture (Family Capability)  The family includes sysDSP blocks and flexible embedded block RAM options to accelerate multiply/accumulate and memory-intensive functions (series-level capability).
  • Power and Supply  Low-voltage core operation with a supply range of 1.14 V to 1.26 V helps reduce system power for energy-conscious designs.
  • Package & Mounting  672-BBGA (672-FPBGA, 27 × 27 mm) surface-mount package provides a compact, high-pin-count option for dense system integration.
  • Commercial Grade & Environmental  Commercial operating temperature of 0 °C to 85 °C and RoHS-compliant construction for supply-chain and regulatory consistency.

Typical Applications

  • High-speed communications  Use the family’s SERDES capabilities and dense logic to implement Ethernet, PCIe, or other high-speed link endpoints and protocol bridges.
  • Embedded networking and connectivity  On-chip memory and plentiful I/O simplify packet buffering, interface bridging and system glue logic for network appliances and infrastructure modules.
  • Signal processing and DSP acceleration  Leverage the family’s sysDSP blocks and embedded RAM for filter, transform, and real-time processing tasks in instrumentation or communications equipment.
  • Interface and protocol conversion  Implement custom transceivers, protocol handlers and multi-standard interface logic using abundant logic elements and I/O resources.

Unique Advantages

  • High integration density: Consolidate multiple discrete functions into a single FPGA with approximately 48,000 logic elements and extensive on-chip memory.
  • Scalable serial connectivity (family-level): Embedded SERDES support up to 3.125 Gbps for modern serial protocols and board-level high-speed links.
  • Compact, high-pin-count package: 672-ball fpBGA (27 × 27 mm) provides extensive I/O in a compact footprint to reduce board area and simplify routing.
  • Low-voltage core: 1.14–1.26 V supply enables lower core power consumption compared to higher-voltage alternatives.
  • Commercial readiness: RoHS-compliant and rated for 0 °C to 85 °C operation to match common embedded and communications product environments.

Why Choose LFE2M50E-7FN672C?

The LFE2M50E-7FN672C combines a high logic element count, multi-megabit embedded memory and abundant I/O in a compact 672-ball fpBGA package, making it well suited for designs that demand integration of protocol handling, buffering and DSP-like functions. Its low-voltage core and family-level support for high-speed serial interfaces give designers options to balance power, performance and connectivity.

This device is ideal for teams developing communications modules, embedded networking hardware, and processing-intensive control systems who need a commercially graded FPGA backed by the Lattice ECP2M family architecture and features.

If you would like pricing, availability or to request a quote for LFE2M50E-7FN672C, submit an inquiry or request a quote through your preferred procurement channel.

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