LFE2M50E-7F672C

The LFE2M50E-7F672C is an ECP2M family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation designed for commercial applications. It provides configurable logic fabric with substantial I/O and embedded memory capacity for a wide range of programmable digital designs.

Key device attributes include 48,000 logic elements, approximately 4.25 Mbits of on-chip RAM, 372 I/O pins, a 672-BBGA package (672-FPBGA, 27×27), a 1.14 V to 1.26 V supply range, and an operating temperature range of 0 °C to 85 °C. The device is RoHS compliant and intended for surface-mount assembly.

Key Features

• Logic Capacity 48,000 logic elements provide a substantial programmable fabric for complex combinational and sequential logic implementations.
• Logic Blocks 6,000 logic blocks as specified, enabling hierarchical design and partitioning of functions across the device.
• Embedded Memory Approximately 4.25 Mbits (4,246,528 bits) of on-chip RAM to support buffering, packet storage, and intermediate data processing without external memory.
• I/O Density 372 user I/O pins to support wide parallel interfaces, multiple peripherals, and high-pin-count designs.
• Power Supply Core supply range of 1.14 V to 1.26 V, allowing designers to target the specified power envelope for the device.
• Package and Mounting 672-BBGA package (supplier: 672-FPBGA, 27×27) for high-density board integration; designed for surface-mount assembly.
• Operating Environment Commercial temperature rating of 0 °C to 85 °C suitable for typical commercial-grade electronics.
• Regulatory RoHS compliant.

Typical Applications

• High-density I/O systems — Use the 372 I/O pins to implement multi-channel interfaces, parallel buses, and board-level routing for communication and control systems.
• On-chip data buffering and processing — Approximately 4.25 Mbits of embedded memory supports packet buffering, FIFO structures, and intermediate data storage for signal processing tasks.
• Programmable logic integration — 48,000 logic elements enable consolidation of glue logic, state machines, and custom peripheral controllers into a single programmable device for commercial products.

Unique Advantages

• Substantial programmable capacity: 48,000 logic elements and 6,000 logic blocks provide room to implement complex logic without multiple discrete devices.
• Significant on-chip memory: Approximately 4.25 Mbits of embedded RAM reduces dependence on external memory for many buffering and processing functions.
• High I/O count: 372 I/O pins support dense connectivity and multiple parallel interfaces on a single package.
• Compact, high-density package: 672-BBGA (672-FPBGA, 27×27) enables high-pin-count routing in a compact footprint for space-constrained PCBs.
• Commercial-grade operating range: Rated 0 °C to 85 °C and RoHS compliant for standard commercial electronics applications.

Why Choose LFE2M50E-7F672C?

The LFE2M50E-7F672C positions itself as a high-capacity, commercially rated FPGA option for designers who need substantial logic resources, on-chip memory, and a large I/O count in a compact BGA package. Its specified supply range and temperature window make it suitable for a broad set of commercial electronic designs.

This device is appropriate for engineering teams building mid-to-high complexity programmable systems that benefit from integrated memory and dense I/O, delivering design scalability within a single-component FPGA solution.

Request a quote or submit a request to receive pricing and availability information for LFE2M50E-7F672C. Our team can provide lead-time and procurement support to help move your design forward.