LFE2M50E-6FN900C

The LFE2M50E-6FN900C is a commercial-grade Field Programmable Gate Array (FPGA) from Lattice Semiconductor's ECP2M family. It delivers a high-density FPGA fabric with 48,000 logic elements and extensive on-chip memory, packaged in a 900-ball FPBGA (31 × 31 mm) for compact, high-I/O system designs.

Designed for embedded and communications-focused systems, this device combines large logic capacity, approximately 4.25 Mbits of embedded RAM, and up to 410 I/Os to enable complex glue-logic, protocol bridges, and system integration tasks while operating from a low core voltage (1.14 V to 1.26 V).

Key Features

• Core Logic  48,000 logic elements (LUT-based fabric) suitable for high-density integration and complex logic implementations.
• Embedded Memory  Approximately 4.25 Mbits of on-chip RAM (total RAM bits: 4,246,528) for embedded data buffering, state machines, and local storage.
• I/O Capacity & Flexibility  Up to 410 I/Os with programmable sysI/O buffer support for a wide range of interface standards, enabling broad connectivity options.
• High‑Speed SERDES (ECP2M family)  Family-level embedded SERDES supporting data rates from 250 Mbps to 3.125 Gbps and multi‑channel operation for serial protocol implementations.
• Clocking & Timing  On-chip analog PLLs and DLLs (family features) including multiple GPLLs and SPLLs to support clock multiplication, division and dynamic adjustment.
• Configuration & System Support  Flexible device configuration options (SPI boot flash interface, dual boot image support) and system-level features such as an on-chip oscillator and internal logic analysis support (family features).
• Power & Thermal  Low-voltage core supply range of 1.14 V to 1.26 V and commercial operating temperature range of 0 °C to 85 °C.
• Package  900-ball FPBGA (31 × 31 mm) package (900-FPBGA) for high-density board-level integration and large I/O counts.
• Regulatory  RoHS compliant.

Typical Applications

• Telecommunications & Networking  Implement protocol handling and packet processing where large logic density and high-speed serial links are required.
• High‑Speed Serial Interfaces  Use embedded SERDES channels for multi‑Gbps links and interfacing with PCI Express, Ethernet (1GbE/SGMII), and other serial standards supported by the family.
• Embedded Systems & Control  Integrate custom control logic, peripheral aggregation, and interface bridging with abundant logic and on-chip memory.
• System Integration & Prototyping  Consolidate discrete functions into a single programmable device to simplify board design and accelerate development cycles.

Unique Advantages

• High integration density: 48,000 logic elements and substantial on-chip RAM reduce external component count and simplify PCB design.
• Broad I/O capability: Up to 410 I/Os in a single 900-ball package enable dense connectivity to peripherals, memory, and interfaces.
• Low-voltage operation: Narrow core supply range (1.14 V–1.26 V) supports efficient power domains and modern low-voltage system architectures.
• Family-level high-speed serial support: Embedded SERDES and protocol support across the ECP2M family enable flexible deployment in communications and data transport roles.
• Flexible configuration and system features: SPI boot, dual-boot capability and on-chip system support features simplify field updates and debugging.
• Commercial temperature rating: Designed for 0 °C to 85 °C operation to meet commercial application requirements.

Why Choose LFE2M50E-6FN900C?

The LFE2M50E-6FN900C positions itself as a versatile, high-density programmable device for embedded and communications-focused designs. With 48,000 logic elements, approximately 4.25 Mbits of embedded memory, up to 410 I/Os and the ECP2M family’s high-speed serial capabilities, it supports consolidated system designs where density, memory, and connectivity matter.

Its combination of programmable resources, flexible configuration options and family-level support for high-speed interfaces makes it suitable for system integrators and OEMs building complex, compact solutions that require scalable FPGA capacity and robust on-chip resources.

Request a quote or submit a sales inquiry to receive pricing and lead-time information for the LFE2M50E-6FN900C and to discuss how it can fit your next design.