LFE2M50E-7F484C
| Part Description |
ECP2M Field Programmable Gate Array (FPGA) IC 270 4246528 48000 484-BBGA |
|---|---|
| Quantity | 392 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 270 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6000 | Number of Logic Elements/Cells | 48000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4246528 |
Overview of LFE2M50E-7F484C – ECP2M Field Programmable Gate Array, 484‑BBGA
The LFE2M50E-7F484C is a Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation, built on the ECP2M family architecture. It provides a mid-density programmable fabric combining 48,000 logic elements, approximately 4.25 Mbits of embedded memory, and up to 270 general-purpose I/O pins in a 484‑ball BGA package.
Designed for commercial-grade applications, this surface-mount FPGA operates from a 1.14 V to 1.26 V core supply and supports an operating temperature range of 0 °C to 85 °C, making it suitable for I/O‑rich embedded designs and moderate on‑chip memory requirements.
Key Features
- Core Logic 48,000 logic elements provide substantial programmable logic capacity for mid-density digital designs.
- Embedded Memory Approximately 4.25 Mbits of on-chip RAM for data buffering, local storage, and state machines.
- I/O Capacity 270 general-purpose I/O pins to support complex peripheral interfacing and parallel data paths.
- Power Core supply voltage range of 1.14 V to 1.26 V to match system power-rail requirements.
- Package & Mounting 484‑BBGA (supplier package: 484‑FPBGA, 23×23) in a surface-mount form factor for compact board integration.
- Operating Range Commercial grade operation from 0 °C to 85 °C for standard environment deployments.
- Environmental Compliance RoHS compliant.
Typical Applications
- Embedded Systems Use the programmable fabric and embedded RAM for custom control logic, protocol implementation, and data handling in embedded devices.
- Communications & Networking Leverage the high I/O count and logic capacity for interface bridging, packet processing, and I/O expansion tasks.
- Test & Measurement Implement custom timing, data acquisition front-ends, and real‑time preprocessing using on‑chip logic and memory.
- Consumer & Industrial Electronics Integrate mid-density programmable logic for display control, sensor interfacing, and user‑interface subsystems within commercial temperature ranges.
Unique Advantages
- Substantial Logic Capacity: 48,000 logic elements enable implementation of sizeable custom logic without external ASICs or discrete glue logic.
- Significant On‑Chip Memory: Approximately 4.25 Mbits of embedded RAM supports buffering and local data storage, reducing the need for external memory in many designs.
- High I/O Density: 270 I/O pins simplify interfacing to multiple peripherals and parallel buses, minimizing external multiplexing.
- Compact BGA Package: 484‑BBGA (23×23) surface-mount package saves PCB area while providing robust connectivity for high‑pin‑count designs.
- Commercial‑Grade Assurance: Rated for 0 °C to 85 °C operation and RoHS compliant to meet standard commercial product requirements.
- Manufacturer Backing: Produced by Lattice Semiconductor Corporation, offering consistent sourcing and part continuity.
Why Choose LFE2M50E-7F484C?
The LFE2M50E-7F484C positions itself as a mid-density, I/O-rich FPGA solution that balances programmable logic capacity, embedded memory, and high pin count within a compact 484‑BBGA package. Its commercial temperature rating and RoHS compliance make it suitable for a wide range of standard-environment embedded and electronics applications.
This part is a practical choice for designers seeking to consolidate logic, reduce external component count, and implement flexible hardware functions with the support of an established semiconductor vendor.
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