LFE2M50E-6FN672C
| Part Description |
ECP2M Field Programmable Gate Array (FPGA) IC 372 4246528 48000 672-BBGA |
|---|---|
| Quantity | 512 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FPBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 372 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6000 | Number of Logic Elements/Cells | 48000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4246528 |
Overview of LFE2M50E-6FN672C – ECP2M FPGA, 672-BBGA, 48k Logic Elements
The LFE2M50E-6FN672C is an ECP2M field programmable gate array (FPGA) from Lattice Semiconductor Corporation. It integrates 48,000 logic elements with substantial embedded memory and a high I/O count in a 672-ball BGA package, providing a compact, configurable logic resource for commercial-grade designs.
Designed for surface-mount assembly and RoHS compliance, this FPGA is supplied for applications that require low-voltage operation within standard commercial temperature limits.
Key Features
- Logic Capacity 48,000 logic elements provide a substantial amount of programmable logic for implementing custom digital functions and moderate to complex designs.
- Embedded Memory Approximately 4.25 Mbits of on-chip RAM (4,246,528 bits) for data buffering, FIFOs, and state storage.
- I/O Resources 372 user I/O pins to support multiple interfaces and peripheral connections in a single device.
- Package and Mounting 672-BBGA (supplier package: 672-FPBGA, 27×27) in a surface-mount footprint for compact board layouts.
- Power Operates from a core supply range of 1.14 V to 1.26 V to match low-voltage system rails.
- Temperature and Grade Commercial grade device rated for 0 °C to 85 °C operating temperature, suitable for standard commercial environments.
- Regulatory RoHS compliant to meet common environmental standards for electronic assemblies.
Unique Advantages
- High logic density: 48,000 logic elements enable integration of multiple functions into a single FPGA, reducing the need for discrete logic ICs.
- Significant on-chip memory: Approximately 4.25 Mbits of embedded RAM supports data buffering and on-chip storage without external memory dependencies.
- Large I/O complement: 372 I/O pins provide flexibility for complex interfacing and multiple peripheral connections on a single device.
- Compact BGA footprint: The 672-BBGA (27×27) package allows dense routing and space-efficient board designs for commercial products.
- Low-voltage core operation: Core supply range of 1.14 V–1.26 V aligns with modern low-voltage systems and power-optimized designs.
- Commercial readiness: Rated for 0 °C–85 °C and RoHS compliant, suitable for a wide range of commercial electronic products.
Why Choose LFE2M50E-6FN672C?
The LFE2M50E-6FN672C balances substantial programmable logic, embedded memory, and a high I/O count in a compact 672-BBGA surface-mount package. Its combination of 48,000 logic elements and approximately 4.25 Mbits of on-chip RAM makes it well suited for commercial designs that require consolidated logic and moderate embedded storage without relying on many external components.
This device is appropriate for engineers and teams seeking a commercially rated, RoHS-compliant FPGA with low-voltage core operation and a dense pinout for board-level integration. It offers a scalable, single-device option to simplify system design and support a range of configurable digital functions.
Request a quote or submit your procurement inquiry today to receive pricing and availability for LFE2M50E-6FN672C. Our team can assist with lead times and order processing to support your project schedule.

Date Founded: 1983
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