LFE2M50E-6FN672C

IC FPGA 372 I/O 672FPBGA
Part Description

ECP2M Field Programmable Gate Array (FPGA) IC 372 4246528 48000 672-BBGA

Quantity 512 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package672-FPBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O372Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6000Number of Logic Elements/Cells48000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4246528

Overview of LFE2M50E-6FN672C – ECP2M FPGA, 672-BBGA, 48k Logic Elements

The LFE2M50E-6FN672C is an ECP2M field programmable gate array (FPGA) from Lattice Semiconductor Corporation. It integrates 48,000 logic elements with substantial embedded memory and a high I/O count in a 672-ball BGA package, providing a compact, configurable logic resource for commercial-grade designs.

Designed for surface-mount assembly and RoHS compliance, this FPGA is supplied for applications that require low-voltage operation within standard commercial temperature limits.

Key Features

  • Logic Capacity  48,000 logic elements provide a substantial amount of programmable logic for implementing custom digital functions and moderate to complex designs.
  • Embedded Memory  Approximately 4.25 Mbits of on-chip RAM (4,246,528 bits) for data buffering, FIFOs, and state storage.
  • I/O Resources  372 user I/O pins to support multiple interfaces and peripheral connections in a single device.
  • Package and Mounting  672-BBGA (supplier package: 672-FPBGA, 27×27) in a surface-mount footprint for compact board layouts.
  • Power  Operates from a core supply range of 1.14 V to 1.26 V to match low-voltage system rails.
  • Temperature and Grade  Commercial grade device rated for 0 °C to 85 °C operating temperature, suitable for standard commercial environments.
  • Regulatory  RoHS compliant to meet common environmental standards for electronic assemblies.

Unique Advantages

  • High logic density: 48,000 logic elements enable integration of multiple functions into a single FPGA, reducing the need for discrete logic ICs.
  • Significant on-chip memory: Approximately 4.25 Mbits of embedded RAM supports data buffering and on-chip storage without external memory dependencies.
  • Large I/O complement: 372 I/O pins provide flexibility for complex interfacing and multiple peripheral connections on a single device.
  • Compact BGA footprint: The 672-BBGA (27×27) package allows dense routing and space-efficient board designs for commercial products.
  • Low-voltage core operation: Core supply range of 1.14 V–1.26 V aligns with modern low-voltage systems and power-optimized designs.
  • Commercial readiness: Rated for 0 °C–85 °C and RoHS compliant, suitable for a wide range of commercial electronic products.

Why Choose LFE2M50E-6FN672C?

The LFE2M50E-6FN672C balances substantial programmable logic, embedded memory, and a high I/O count in a compact 672-BBGA surface-mount package. Its combination of 48,000 logic elements and approximately 4.25 Mbits of on-chip RAM makes it well suited for commercial designs that require consolidated logic and moderate embedded storage without relying on many external components.

This device is appropriate for engineers and teams seeking a commercially rated, RoHS-compliant FPGA with low-voltage core operation and a dense pinout for board-level integration. It offers a scalable, single-device option to simplify system design and support a range of configurable digital functions.

Request a quote or submit your procurement inquiry today to receive pricing and availability for LFE2M50E-6FN672C. Our team can assist with lead times and order processing to support your project schedule.

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