LFE2M50E-6F900C

The LFE2M50E-6F900C is an FPGA device from the Lattice ECP2/M family provided in a 900-ball BBGA (31 × 31 mm) package. It delivers a high-density logic fabric with 48,000 logic elements and approximately 4.25 Mbits of embedded memory, paired with up to 410 user I/Os for system-level integration in commercial temperature applications.

As a member of the Lattice ECP2/M family, this device aligns with architectures designed for high logic density, embedded DSP and memory resources, flexible I/O standards and on-chip clock management—making it suitable for connectivity, DSP and system integration tasks in commercial designs.

Key Features

• Logic Capacity — 48,000 logic elements, enabling medium-to-high complexity digital designs and system integration tasks.
• Embedded Memory — Total RAM bits: 4,246,528 (approximately 4.25 Mbits) of on-chip memory for frame buffering, FIFOs and embedded data storage.
• I/O Density — 410 user I/Os available in the 900-ball BBGA package to support a wide range of external interfaces and peripherals.
• Package & Mounting — 900-ball FBGA (31 × 31 mm) surface-mount package (supplier device package: 900-FPBGA) for compact board-level integration.
• Power — Core supply voltage range 1.14 V to 1.26 V to match system power rails and power budgeting requirements.
• Operating Range — Commercial grade operation from 0 °C to 85 °C suitable for standard commercial-environment applications.
• Family Capabilities (Lattice ECP2/M) — Series features include embedded sysDSP blocks, flexible embedded block RAM, system PLLs/DLLs and high-speed SERDES (LatticeECP2M family), enabling DSP, memory branching and high-speed serial interfaces where applicable.
• Regulatory — RoHS compliant for environmental and assembly compliance.

Typical Applications

• High-speed connectivity — Implement protocols and interfaces that require significant I/O count and SERDES-based links supported by the ECP2/M family.
• Signal processing & DSP — Use embedded DSP resources and on-chip memory for real-time filtering, accumulation and algorithm acceleration.
• Memory interface and buffering — Drive DDR-style or other external memories and implement on-chip buffering using the device’s embedded RAM.
• System integration — Consolidate peripheral glue logic, protocol bridges and custom control functions into a single FPGA to reduce BOM and board complexity.

Unique Advantages

• High logic density: 48,000 logic elements provide headroom for complex control, datapath and interface logic within a single device.
• Substantial embedded memory: Approximately 4.25 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage tasks.
• Extensive I/O: 410 available I/Os in a compact 900-BBGA package support multiple parallel interfaces and mixed I/O standards.
• Family-level DSP and SERDES support: Access to ECP2/M family features such as sysDSP blocks, PLLs/DLLs and high-speed SERDES for designs that require DSP acceleration and serial connectivity.
• Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C and RoHS compliant for mainstream commercial applications and assembly processes.
• Low-voltage core operation: Core supply range of 1.14 V to 1.26 V enables power-optimized designs aligned with modern power rails.

Why Choose LFE2M50E-6F900C?

The LFE2M50E-6F900C combines substantial logic capacity, multi-megabit embedded memory and a high I/O count in a 900-ball BBGA package, making it well suited for commercial designs that require integrated DSP, buffering and connectivity. Its alignment with the Lattice ECP2/M family means designers can leverage family-level capabilities—such as sysDSP blocks and SERDES—where those features are applicable.

This part fits designers and teams aiming to consolidate system functions into a single FPGA, reduce board-level complexity, and implement mid-to-high complexity logic and data processing in commercial-temperature environments with RoHS-compliant assembly.

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