LFE2M50E-6F484I
| Part Description |
ECP2M Field Programmable Gate Array (FPGA) IC 270 4246528 48000 484-BBGA |
|---|---|
| Quantity | 1,694 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 270 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6000 | Number of Logic Elements/Cells | 48000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4246528 |
Overview of LFE2M50E-6F484I – ECP2M FPGA, 48,000 logic elements, 270 I/Os, Industrial
The LFE2M50E-6F484I is a field programmable gate array (FPGA) IC from Lattice Semiconductor designed for industrial embedded applications. It provides a mid-range integration point with 48,000 logic elements, approximately 4.25 Mbits of embedded memory, and up to 270 general-purpose I/O pins to consolidate logic and interfacing tasks.
With a 484-ball BGA package, industrial temperature rating, and a narrow core voltage range, this device targets designs that require reliable operation across extended temperature ranges and compact, surface-mount board implementations.
Key Features
- Core Logic 48,000 logic elements provide substantial programmable resource density for implementing complex combinational and sequential logic functions.
- Embedded Memory Approximately 4.25 Mbits of on-chip RAM to support buffering, FIFOs, and small embedded data storage without external memory.
- I/O Density Up to 270 I/O pins enable consolidation of multiple interfaces and signal domains onto a single device, reducing board-level routing complexity.
- Power Supply Operates from a core voltage range of 1.14 V to 1.26 V, suitable for systems designed around low-voltage core supply rails.
- Package & Mounting 484-ball FPBGA (23 × 23 mm) in a 484-BBGA package with surface-mount mounting for compact, high-density PCB layouts.
- Operating Range Industrial-grade temperature operation from −40 °C to 100 °C for deployment in environments with wide thermal variation.
- RoHS Compliant Environmentally compliant with RoHS requirements.
Typical Applications
- Industrial Embedded Systems — Use the industrial temperature rating and high I/O count to implement control, monitoring, and edge-processing functions in factory and process automation equipment.
- Interface Consolidation — Leverage 270 I/Os and on-chip memory to combine multiple peripheral interfaces and buffering logic onto a single FPGA, reducing board-level BOM and connector count.
- Custom Logic and Acceleration — Deploy programmable logic resources and embedded RAM to implement specialized data paths, protocol handling, or function acceleration within embedded products.
Unique Advantages
- Substantial Logic Capacity: 48,000 logic elements enable implementation of sizeable custom logic functions without immediately moving to larger devices.
- Significant On-Chip RAM: Approximately 4.25 Mbits of embedded memory reduces dependence on external RAM for many buffering and state-storage needs.
- High I/O Count: 270 I/Os support multi-interface designs, simplifying system integration and lowering peripheral routing complexity.
- Industrial Temperature Rating: Rated from −40 °C to 100 °C for reliable operation in temperature-challenging environments.
- Compact BGA Package: 484-ball FPBGA (23 × 23 mm) supports high-density PCB designs while enabling robust surface-mount assembly.
- RoHS Compliance: Environmentally compliant for markets that require lead-free components.
Why Choose LFE2M50E-6F484I?
The LFE2M50E-6F484I positions itself as a versatile mid-range FPGA for industrial embedded designs that need a balance of logic capacity, on-chip memory, and generous I/O in a compact BGA footprint. Its industrial temperature rating and RoHS compliance make it suitable for long-life deployed equipment where environmental robustness matters.
Designers seeking to consolidate interfaces, implement custom acceleration, or centralize control logic will find the combination of 48,000 logic elements, ~4.25 Mbits of embedded RAM, and 270 I/Os beneficial for reducing board-level complexity and component count while maintaining a compact surface-mount package.
Request a quote or submit a purchase inquiry to receive pricing, availability, and lead-time information for the LFE2M50E-6F484I. Our team can assist with volume pricing and delivery options to support your project timeline.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016