LFE2M50E-6F484I

IC FPGA 270 I/O 484FBGA
Part Description

ECP2M Field Programmable Gate Array (FPGA) IC 270 4246528 48000 484-BBGA

Quantity 1,694 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O270Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6000Number of Logic Elements/Cells48000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4246528

Overview of LFE2M50E-6F484I – ECP2M FPGA, 48,000 logic elements, 270 I/Os, Industrial

The LFE2M50E-6F484I is a field programmable gate array (FPGA) IC from Lattice Semiconductor designed for industrial embedded applications. It provides a mid-range integration point with 48,000 logic elements, approximately 4.25 Mbits of embedded memory, and up to 270 general-purpose I/O pins to consolidate logic and interfacing tasks.

With a 484-ball BGA package, industrial temperature rating, and a narrow core voltage range, this device targets designs that require reliable operation across extended temperature ranges and compact, surface-mount board implementations.

Key Features

  • Core Logic 48,000 logic elements provide substantial programmable resource density for implementing complex combinational and sequential logic functions.
  • Embedded Memory Approximately 4.25 Mbits of on-chip RAM to support buffering, FIFOs, and small embedded data storage without external memory.
  • I/O Density Up to 270 I/O pins enable consolidation of multiple interfaces and signal domains onto a single device, reducing board-level routing complexity.
  • Power Supply Operates from a core voltage range of 1.14 V to 1.26 V, suitable for systems designed around low-voltage core supply rails.
  • Package & Mounting 484-ball FPBGA (23 × 23 mm) in a 484-BBGA package with surface-mount mounting for compact, high-density PCB layouts.
  • Operating Range Industrial-grade temperature operation from −40 °C to 100 °C for deployment in environments with wide thermal variation.
  • RoHS Compliant Environmentally compliant with RoHS requirements.

Typical Applications

  • Industrial Embedded Systems — Use the industrial temperature rating and high I/O count to implement control, monitoring, and edge-processing functions in factory and process automation equipment.
  • Interface Consolidation — Leverage 270 I/Os and on-chip memory to combine multiple peripheral interfaces and buffering logic onto a single FPGA, reducing board-level BOM and connector count.
  • Custom Logic and Acceleration — Deploy programmable logic resources and embedded RAM to implement specialized data paths, protocol handling, or function acceleration within embedded products.

Unique Advantages

  • Substantial Logic Capacity: 48,000 logic elements enable implementation of sizeable custom logic functions without immediately moving to larger devices.
  • Significant On-Chip RAM: Approximately 4.25 Mbits of embedded memory reduces dependence on external RAM for many buffering and state-storage needs.
  • High I/O Count: 270 I/Os support multi-interface designs, simplifying system integration and lowering peripheral routing complexity.
  • Industrial Temperature Rating: Rated from −40 °C to 100 °C for reliable operation in temperature-challenging environments.
  • Compact BGA Package: 484-ball FPBGA (23 × 23 mm) supports high-density PCB designs while enabling robust surface-mount assembly.
  • RoHS Compliance: Environmentally compliant for markets that require lead-free components.

Why Choose LFE2M50E-6F484I?

The LFE2M50E-6F484I positions itself as a versatile mid-range FPGA for industrial embedded designs that need a balance of logic capacity, on-chip memory, and generous I/O in a compact BGA footprint. Its industrial temperature rating and RoHS compliance make it suitable for long-life deployed equipment where environmental robustness matters.

Designers seeking to consolidate interfaces, implement custom acceleration, or centralize control logic will find the combination of 48,000 logic elements, ~4.25 Mbits of embedded RAM, and 270 I/Os beneficial for reducing board-level complexity and component count while maintaining a compact surface-mount package.

Request a quote or submit a purchase inquiry to receive pricing, availability, and lead-time information for the LFE2M50E-6F484I. Our team can assist with volume pricing and delivery options to support your project timeline.

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