LFE2M50E-5FN672I

The LFE2M50E-5FN672I is an industrial-grade field programmable gate array (FPGA) provided in a 672-ball BGA package. It delivers a balance of programmable logic density, embedded RAM, and a high I/O count for designs that require substantial on-chip resources in a compact surface-mount package.

Its core attributes—48,000 logic elements, approximately 4.25 Mbits of embedded memory, 372 I/Os, and a low-voltage supply range—make it well suited for applications requiring flexible logic implementation, moderate embedded memory, and robust operating-temperature tolerance.

Key Features

• Core Logic 48,000 logic elements to implement complex programmable logic functions and custom hardware accelerators.
• Embedded Memory Approximately 4.25 Mbits of on-chip RAM to support buffering, lookup tables, and state storage without external memory.
• I/O Capacity 372 user I/Os to interface with sensors, peripherals, and board-level buses, enabling broad connectivity options.
• Power Core voltage supply range of 1.14 V to 1.26 V for low-voltage operation and predictable power planning.
• Package & Mounting 672-BBGA (supplier package: 672-FPBGA 27 × 27) in a surface-mount format for high-density board integration.
• Temperature & Grade Industrial grade operation with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Regulatory RoHS-compliant construction for environmentally conscious designs and regulatory alignment.

Typical Applications

• Industrial Control Implement custom control logic and signal processing where industrial temperature range and robust I/O are required.
• Communications Equipment Use the high I/O count and embedded RAM for protocol handling, buffering, and glue logic in communications systems.
• Data Acquisition & Signal Conditioning Integrate front-end interfacing and on-chip processing for sensor arrays and data-collection systems.

Unique Advantages

• High Logic Density: 48,000 logic elements provide substantial programmable capacity for complex designs without external logic.
• Significant On-Chip Memory: Approximately 4.25 Mbits of embedded RAM reduces reliance on external memory and simplifies board design.
• Large I/O Count: 372 I/Os enable direct interfacing to numerous peripherals and parallel buses, cutting the need for external multiplexers.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in temperature-sensitive deployments.
• Compact BGA Package: 672-BBGA (27 × 27 FPBGA) offers a compact footprint for high-density PCBs while supporting many signal connections.
• Low-Voltage Core: 1.14 V to 1.26 V supply range supports modern low-voltage system designs and power budgeting.

Why Choose LFE2M50E-5FN672I?

The LFE2M50E-5FN672I positions itself as a compact, industrial-grade FPGA option that combines mid-to-high logic capacity, meaningful embedded memory, and a large I/O complement in a single surface-mount BGA package. Its specifications address designs that need flexible programmable logic alongside substantial local RAM and broad external interfacing.

This device is appropriate for engineers and procurement teams targeting long-term deployments where industrial temperature tolerance and RoHS compliance matter, and where board-level integration density and predictable low-voltage operation are priorities.

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