LFE2M50E-5F900I

The LFE2M50E-5F900I is an industrial-grade ECP2M family Field Programmable Gate Array (FPGA) offered in a 900-ball BGA package. It provides a combination of high logic density, substantial on-chip memory, and a large I/O count to support complex programmable logic designs.

With 48,000 logic elements, approximately 4.25 Mbits of embedded memory and 410 I/O, this device targets designs that require significant logic resources and I/O connectivity while operating across an industrial temperature range.

Key Features

• Logic Capacity — 48,000 logic elements to implement medium-to-high complexity logic and custom digital functions.
• Embedded Memory — Approximately 4.25 Mbits of on-chip RAM (4,246,528 bits) for block buffering, FIFOs, and data-path storage.
• High I/O Count — 410 user I/O pins to support dense external interfaces and multiple parallel connections.
• Power — Core supply range of 1.14 V to 1.26 V for the device core voltage requirements.
• Package and Mounting — 900-ball BGA (900-FPBGA, 31 × 31 mm) in a surface-mount configuration for compact board-level integration.
• Industrial Temperature Rating — Operating range from -40 °C to 100 °C, suitable for industrial-environment deployments.
• RoHS Compliant — Meets RoHS environmental restrictions.

Typical Applications

• High-density I/O systems — Use the 410 I/O pins to interface with multiple parallel buses, sensors, and peripherals requiring numerous signal lines.
• Memory-intensive logic — Leverage approximately 4.25 Mbits of embedded RAM for buffering, packet handling, or data-path acceleration.
• Industrial control and automation — Industrial-grade operation and a wide temperature range support controllers and automation equipment exposed to varying environmental conditions.
• Custom digital processing — 48,000 logic elements enable implementation of application-specific accelerators, protocol handling, and glue-logic.

Unique Advantages

• Significant logic density: 48,000 logic elements allow consolidation of multiple functions into a single device, reducing board-level complexity.
• Substantial on-chip memory: Approximately 4.25 Mbits of RAM reduce dependence on external memory for intermediate storage and buffering.
• Large I/O capability: 410 I/O pins facilitate connectivity to a wide range of external devices and interfaces without additional multiplexing.
• Industrial robustness: Rated for -40 °C to 100 °C operation, suitable for many industrial applications and deployments.
• Compact package integration: 900-ball FPBGA (31 × 31 mm) enables high-density PCB layouts while maintaining robust soldered mounting.
• Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing and end-product requirements.

Why Choose LFE2M50E-5F900I?

The LFE2M50E-5F900I delivers a balanced combination of logic capacity, embedded memory and I/O density in an industrial-grade FPGA package. Its specification set makes it well suited for designers who need substantial programmable logic and on-chip RAM while operating across a wide temperature range.

This device is appropriate for development teams and product designers focused on industrial automation, high-density interface implementations, and custom digital processing where integration, reliability, and on-chip resources are key considerations.

Request a quote or submit an inquiry to receive pricing and availability for the LFE2M50E-5F900I. Our team will provide the information you need to move your design forward.