LFE2M50E-5F672I

The LFE2M50E-5F672I is a Field Programmable Gate Array (FPGA) IC in the ECP2M family. It provides 48,000 logic elements and approximately 4.25 Mbits of embedded memory in a high-density 672-BBGA package.

Designed and specified for industrial-grade use, the device includes 372 I/O, a 1.14 V to 1.26 V supply range, and an operating temperature range from −40 °C to 100 °C, making it suitable for deployments that require robust temperature tolerance and dense logic and memory integration.

Key Features

• Core Logic 48,000 logic elements provide the programmable fabric for implementing custom digital functions and data paths.
• Embedded Memory Approximately 4.25 Mbits of on-chip RAM for buffering, FIFOs, and local storage to support complex logic designs.
• I/O Capacity 372 I/O pins enable extensive external interfacing and signal routing for multi-channel systems.
• Power Specified supply range of 1.14 V to 1.26 V to match platform power requirements.
• Package & Mounting 672-BBGA package (supplier device package: 672-FPBGA, 27 × 27) in a surface-mount form factor for high-density board designs.
• Temperature Range Industrial operating range from −40 °C to 100 °C for temperature-tolerant applications.
• Compliance RoHS compliant, supporting environmental and regulatory considerations for lead-free assembly.

Typical Applications

• Industrial Control Use the device's industrial temperature rating, extensive I/O count, and large logic capacity for control and automation subsystems.
• High-Density Interface Aggregation 372 I/O and significant on-chip memory support aggregation and routing of multiple interface channels in compact designs.
• Embedded Processing and Prototyping Large logic fabric and embedded RAM make the FPGA suitable for custom embedded logic implementations and hardware prototyping.
• Signal Conditioning and Data Buffering On-chip RAM and programmable logic offer local buffering and preprocessing for data streams before off-chip transfer.

Unique Advantages

• High logic density: 48,000 logic elements enable implementation of large or multi-function designs within one FPGA package, reducing system complexity.
• Substantial embedded memory: Approximately 4.25 Mbits of on-chip RAM supports data buffering and local storage without requiring additional external memory.
• Extensive I/O availability: 372 I/O pins simplify connection to multiple sensors, buses, or peripheral devices, reducing board routing effort.
• Industrial temperature rating: −40 °C to 100 °C operation provides robustness for temperature-challenging environments.
• Compact, surface-mount package: 672-BBGA (672-FPBGA, 27 × 27) enables high-density board layouts while maintaining a large resource set.
• RoHS compliant: Supports lead-free assembly and environmental compliance requirements.

Why Choose LFE2M50E-5F672I?

The LFE2M50E-5F672I combines a large logic fabric, significant embedded memory, and a high I/O count within an industrial-grade, surface-mount 672-BBGA package. Its specified supply range and wide operating temperature make it appropriate for applications that require both density and temperature tolerance.

This FPGA is well suited to designers and engineers building systems that need integrated logic capacity, local memory, and broad interfacing in a compact package—offering scalability and robustness through its combination of resources and industrial specifications.

Request a quote or submit an inquiry today to check pricing and availability for the LFE2M50E-5F672I.