LFE2M50E-5F484I
| Part Description |
ECP2M Field Programmable Gate Array (FPGA) IC 270 4246528 48000 484-BBGA |
|---|---|
| Quantity | 237 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 270 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6000 | Number of Logic Elements/Cells | 48000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4246528 |
Overview of LFE2M50E-5F484I – ECP2M Field Programmable Gate Array (FPGA), 48,000 logic elements
The LFE2M50E-5F484I is an ECP2M family Field Programmable Gate Array from Lattice Semiconductor Corporation designed for embedded logic integration. It provides 48,000 logic elements, approximately 4.25 Mbits of embedded memory, and 270 user I/O pins in a 484-ball BGA package.
Rated for industrial operation, the device supports a supply voltage range of 1.14 V to 1.26 V and an operating temperature range of −40 °C to 100 °C, making it suitable for designs that require a combination of logic capacity, on-chip memory, and robust temperature performance.
Key Features
- Core Logic 48,000 logic elements provide the programmable fabric required for mid-density FPGA designs.
- Embedded Memory Approximately 4.25 Mbits of on-chip RAM (4,246,528 total RAM bits) for buffering, line-rate processing, and state storage.
- I/O Capacity 270 user I/O pins enable broad connectivity options to external devices and system peripherals.
- Power Operates from a VCC range of 1.14 V to 1.26 V to match compatible system power rails.
- Package & Mounting Supplied in a 484-ball fine-pitch BGA (484-FPBGA, 23 × 23) for compact, surface-mount PCB integration.
- Temperature & Grade Industrial-grade device with an operating temperature range of −40 °C to 100 °C for reliable performance across demanding environments.
- Environmental Compliance RoHS-compliant construction supports regulatory and environmental requirements.
Unique Advantages
- High logic capacity: 48,000 logic elements allow for substantial on-chip design integration and custom hardware acceleration.
- Significant embedded memory: Approximately 4.25 Mbits of RAM reduces reliance on external memory for many buffering and stateful processing tasks.
- Generous I/O count: 270 user I/Os enable complex system interfacing and multiple peripheral connections without extensive external multiplexing.
- Industrial temperature rating: −40 °C to 100 °C operation supports deployment in temperature-challenging environments.
- Compact BGA package: 484-ball FPBGA (23 × 23) offers a space-efficient footprint for high-density PCB layouts.
- RoHS compliance: Meets lead-free and material restrictions for environmentally conscious designs.
Why Choose LFE2M50E-5F484I?
The LFE2M50E-5F484I balances substantial logic density, embedded memory, and a high I/O count in a compact 484-ball BGA package, making it a practical choice for mid-density FPGA implementations that require industrial-temperature operation. Its defined supply voltage range and RoHS compliance provide predictable integration and environmental conformance for production designs.
This device is suited for engineers and procurement teams looking for an FPGA option that combines programmable logic capacity, on-chip RAM, and a robust operating temperature window from a recognized semiconductor manufacturer.
Request a quote or submit an inquiry to receive pricing, availability, or additional technical information for the LFE2M50E-5F484I.

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