LFE2M50E-5F484I

IC FPGA 270 I/O 484FBGA
Part Description

ECP2M Field Programmable Gate Array (FPGA) IC 270 4246528 48000 484-BBGA

Quantity 237 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O270Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6000Number of Logic Elements/Cells48000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4246528

Overview of LFE2M50E-5F484I – ECP2M Field Programmable Gate Array (FPGA), 48,000 logic elements

The LFE2M50E-5F484I is an ECP2M family Field Programmable Gate Array from Lattice Semiconductor Corporation designed for embedded logic integration. It provides 48,000 logic elements, approximately 4.25 Mbits of embedded memory, and 270 user I/O pins in a 484-ball BGA package.

Rated for industrial operation, the device supports a supply voltage range of 1.14 V to 1.26 V and an operating temperature range of −40 °C to 100 °C, making it suitable for designs that require a combination of logic capacity, on-chip memory, and robust temperature performance.

Key Features

  • Core Logic  48,000 logic elements provide the programmable fabric required for mid-density FPGA designs.
  • Embedded Memory  Approximately 4.25 Mbits of on-chip RAM (4,246,528 total RAM bits) for buffering, line-rate processing, and state storage.
  • I/O Capacity  270 user I/O pins enable broad connectivity options to external devices and system peripherals.
  • Power  Operates from a VCC range of 1.14 V to 1.26 V to match compatible system power rails.
  • Package & Mounting  Supplied in a 484-ball fine-pitch BGA (484-FPBGA, 23 × 23) for compact, surface-mount PCB integration.
  • Temperature & Grade  Industrial-grade device with an operating temperature range of −40 °C to 100 °C for reliable performance across demanding environments.
  • Environmental Compliance  RoHS-compliant construction supports regulatory and environmental requirements.

Unique Advantages

  • High logic capacity: 48,000 logic elements allow for substantial on-chip design integration and custom hardware acceleration.
  • Significant embedded memory: Approximately 4.25 Mbits of RAM reduces reliance on external memory for many buffering and stateful processing tasks.
  • Generous I/O count: 270 user I/Os enable complex system interfacing and multiple peripheral connections without extensive external multiplexing.
  • Industrial temperature rating: −40 °C to 100 °C operation supports deployment in temperature-challenging environments.
  • Compact BGA package: 484-ball FPBGA (23 × 23) offers a space-efficient footprint for high-density PCB layouts.
  • RoHS compliance: Meets lead-free and material restrictions for environmentally conscious designs.

Why Choose LFE2M50E-5F484I?

The LFE2M50E-5F484I balances substantial logic density, embedded memory, and a high I/O count in a compact 484-ball BGA package, making it a practical choice for mid-density FPGA implementations that require industrial-temperature operation. Its defined supply voltage range and RoHS compliance provide predictable integration and environmental conformance for production designs.

This device is suited for engineers and procurement teams looking for an FPGA option that combines programmable logic capacity, on-chip RAM, and a robust operating temperature window from a recognized semiconductor manufacturer.

Request a quote or submit an inquiry to receive pricing, availability, or additional technical information for the LFE2M50E-5F484I.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1983


    Headquarters: Hillsboro, Oregon, USA


    Employees: 1,000+


    Revenue: $627.7 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up