LFE2M50E-5FN484C

The LFE2M50E-5FN484C is an ECP2M Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation in a 484‑BBGA package. It provides a high-density programmable logic fabric with substantial on-chip memory and a large I/O count for designs that require configurable logic, embedded memory, and flexible connectivity.

With 48,000 logic elements, approximately 4.25 Mbits of embedded memory and up to 270 I/O pins, this commercial‑grade FPGA targets applications that need integrated logic resources in a compact surface‑mount package while operating from a 1.14 V–1.26 V supply and a 0 °C to 85 °C temperature range.

Key Features

• Core Logic — 48,000 logic elements to implement complex programmable logic functions and custom accelerators.
• Embedded Memory — Approximately 4.25 Mbits of on‑chip RAM for data buffering, FIFOs, and state storage.
• I/O Capacity — Up to 270 user I/O pins to support broad interfacing needs in dense systems.
• Package & Mounting — 484‑BBGA package, supplier device package 484‑FPBGA (23×23), designed for surface‑mount assembly.
• Power — Operates from a 1.14 V to 1.26 V supply range suitable for 1.2 V system rails.
• Commercial Temperature Range — Rated for 0 °C to 85 °C operation and designated as commercial grade.
• RoHS Compliant — Meets RoHS requirements for reduced hazardous substances.

Typical Applications

• Embedded Systems — Implement custom logic blocks and memory‑intensive functions using the device’s 48,000 logic elements and embedded RAM.
• Communications Interfaces — Leverage the large I/O count to route multiple parallel or serial interfaces directly to the FPGA fabric.
• Industrial Control — Create configurable control logic and buffering solutions that operate within commercial temperature ranges.

Unique Advantages

• High‑density Logic Capacity: 48,000 logic elements enable consolidation of multiple functions into a single programmable device, reducing board-level component count.
• Substantial Embedded Memory: Approximately 4.25 Mbits of on‑chip RAM supports local data storage, buffering and state machines without external memory.
• Extensive I/O Connectivity: 270 I/O pins provide headroom for interfacing to a wide range of peripherals and subsystems.
• Compact BGA Packaging: 484‑BBGA (supplier package 484‑FPBGA 23×23) offers a space‑efficient footprint for high‑density board designs.
• 1.2 V‑Class Supply: Operation from 1.14 V to 1.26 V aligns with common low‑voltage system rails to simplify power supply design.
• RoHS Compliance: Environmentally compliant construction supports regulatory requirements for many commercial products.

Why Choose LFE2M50E-5FN484C?

The LFE2M50E-5FN484C delivers a balanced combination of programmable logic density, embedded memory and flexible I/O in a compact surface‑mount BGA package. Its 48,000 logic elements and approximately 4.25 Mbits of on‑chip RAM make it suitable for designs that consolidate multiple functions onto a single FPGA, reducing BOM complexity and board area.

Targeted at commercial applications that operate from 1.14 V–1.26 V and within a 0 °C–85 °C range, this device is appropriate for customers seeking scalable, integrated logic and memory resources with broad I/O capability and RoHS compliance.

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