LFE2M50E-5FN900C

The LFE2M50E-5FN900C is an ECP2M family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation configured in a 900-ball BGA package. It integrates a large programmable fabric with a high I/O count and substantial on-chip memory to support complex logic, interface and buffering requirements.

With 48,000 logic elements, approximately 4.25 Mbits of embedded RAM, and up to 410 I/O pins, this commercial-grade FPGA is suited for designs that require dense logic capacity, significant embedded memory, and extensive external connectivity within a surface-mount 900-FPBGA (31×31) footprint.

Key Features

• Logic Capacity 48,000 logic elements to implement complex custom logic, state machines, and parallel datapaths.
• Embedded Memory Approximately 4.25 Mbits of on-chip RAM for frame buffering, lookup tables, and temporary data storage.
• I/O Count Up to 410 user I/O pins to support multiple high-density interfaces and board-level connectivity.
• Power Supply Operates from a core voltage range of 1.14 V to 1.26 V to match modern low-voltage system rails.
• Package & Mounting 900-ball FBGA (900-FPBGA, 31×31) in a surface-mount package for compact PCB integration.
• Operating Range & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C for typical commercial environments.
• Compliance RoHS compliant to meet standard environmental and manufacturing requirements.

Typical Applications

• Communications & Networking Use the high I/O count and abundant logic elements for protocol implementation, packet processing, and interface bridging.
• Video and Signal Processing Leverage the large embedded RAM and logic capacity for buffering, preprocessing and custom video pipelines.
• Embedded System Acceleration Offload compute-intensive tasks and implement hardware accelerators using the programmable fabric and on-chip memory.
• Prototyping and Custom Logic Deploy in development platforms or production boards to realize tailored control logic, timing-critical functions, and multi-interface designs.

Unique Advantages

• Substantial Logic Density: 48,000 logic elements provide the resources to consolidate multiple functions into a single FPGA, reducing BOM and board complexity.
• Significant On-Chip Memory: Approximately 4.25 Mbits of embedded RAM supports buffering and local data storage without relying on external memory for many use cases.
• High I/O Capacity: Up to 410 I/O pins enable direct connection to multiple peripherals, sensors, and transceivers, simplifying system partitioning.
• Compact Surface-Mount Package: 900-FPBGA (31×31) footprint allows integration into space-constrained PCBs while supporting dense pin routing.
• Commercial Temperature and RoHS Compliance: Designed for commercial deployments with standard operating temperature coverage and RoHS compliance for manufacturing consistency.

Why Choose LFE2M50E-5FN900C?

The LFE2M50E-5FN900C positions itself as a flexible, high-capacity FPGA option for commercial designs that require a combination of dense logic, meaningful embedded memory, and extensive I/O. Its 900-ball FBGA package enables compact board integration while delivering resources suitable for communications, video, acceleration, and custom logic tasks.

Engineers and procurement teams looking for a programmable silicon option with clear, verifiable specifications—48,000 logic elements, approximately 4.25 Mbits of RAM, 410 I/Os, and a defined commercial operating range—will find this device appropriate for scalable designs where integration and connectivity are priorities.

Request a quote or submit a sales inquiry to check availability and pricing for the LFE2M50E-5FN900C.