LFE2M50E-6F484C

The LFE2M50E-6F484C is a field programmable gate array (FPGA) IC from Lattice Semiconductor's ECP2M family. It provides a large programmable fabric with 48,000 logic elements and approximately 4.25 Mbits of embedded RAM for on-chip data buffering and state storage.

Designed for commercial-grade applications, this device offers up to 270 general-purpose I/O in a 484-ball BGA (484-FPBGA, 23×23) surface-mount package, operates from a 1.14 V to 1.26 V supply, and supports an ambient temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Logic Capacity 48,000 logic elements provide a substantial programmable fabric for implementing complex digital functions.
• Embedded Memory Approximately 4.25 Mbits of on-chip RAM for data buffering, LUT-based storage, and state machines.
• I/O Density Up to 270 user I/O pins to support multiple interfaces and parallel connections.
• Package & Mounting 484-BBGA (listed as 484-FPBGA, 23×23) in a surface-mount form factor for compact board integration.
• Power Supply Single-core supply range from 1.14 V to 1.26 V for the FPGA core.
• Operating Conditions Commercial grade device rated for 0 °C to 85 °C ambient operation.
• Environmental Compliance RoHS compliant to meet common regulatory requirements for electronics manufacturing.

Typical Applications

• Embedded Systems — Implement custom control logic, protocol handling, and peripheral interfacing using a large programmable fabric and on-chip RAM.
• Communications Hardware — Support interface bridging and protocol logic with high I/O count and flexible routing resources.
• Prototyping and Product Development — Evaluate and iterate hardware designs that require substantial logic capacity and on-chip memory in a compact BGA package.

Unique Advantages

• High Logic Density: 48,000 logic elements enable implementation of complex logic blocks and multiple functions within a single device, reducing the need for additional components.
• Significant On-Chip RAM: Approximately 4.25 Mbits of embedded memory supports data buffering and state retention without external memory.
• Broad I/O Count: 270 I/O pins provide flexibility for interfacing to sensors, peripherals, and high-pin-count connectors.
• Compact, Surface-Mount Package: 484-BBGA (484-FPBGA, 23×23) allows dense board layouts while keeping the design surface-mount friendly.
• Commercial Temperature Range: Rated for 0 °C to 85 °C operation, aligning with mainstream commercial product requirements.
• Regulatory Readiness: RoHS compliance helps streamline regulatory considerations for assembly and distribution.

Why Choose LFE2M50E-6F484C?

The LFE2M50E-6F484C balances substantial programmable resources with a high I/O count and compact BGA packaging, making it suitable for commercial designs that require extensive logic, embedded memory, and flexible connectivity. Its supply voltage and operating temperature specifications provide a clear integration profile for board-level designs.

Engineers and procurement teams seeking a RoHS-compliant FPGA with approximately 48,000 logic elements and 4.25 Mbits of on-chip RAM will find this device appropriate for prototyping and production deployments in commercial applications, offering a scalable option within the ECP2M family.

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