LFE2M50E-6F900I

The LFE2M50E-6F900I is an ECP2M Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It combines 48,000 logic elements, approximately 4.25 Mbits of embedded memory, and 410 I/O in a high‑density 900‑BBGA package.

Designed for industrial applications, the device supports low‑voltage operation (1.14–1.26 V) and an operating temperature range of −40 °C to 100 °C, delivering a balance of logic capacity, on‑chip memory, and I/O density for embedded designs.

Key Features

• Core Logic 48,000 logic elements and 6,000 CLBs provide substantial programmable fabric for complex digital functions.
• Embedded Memory Approximately 4.25 Mbits of on‑chip RAM for buffering, FIFOs, and local data storage without relying on external memory.
• I/O Density 410 available I/O pins to support high‑pin‑count interfaces and multiple parallel or serial connections.
• Power Low‑voltage supply range of 1.14 V to 1.26 V to match modern system power rails and support efficient designs.
• Package & Mounting 900‑BBGA package (supplier device package: 900‑FPBGA, 31×31); surface mount mounting for compact board integration.
• Temperature & Grade Industrial grade operation from −40 °C to 100 °C for deployment in temperature‑challenging environments.
• Environmental Compliance RoHS compliant for alignment with common environmental requirements.

Typical Applications

• Industrial Control Utilizes industrial temperature rating and high I/O count for PLC I/O expansion, motor control interfaces, and I/O aggregation.
• Interface Bridging and Protocol Conversion High I/O density and programmable logic enable protocol translation and bus bridging in embedded systems.
• Embedded Data Processing Large logic capacity and on‑chip memory support custom datapaths, buffering, and accelerator functions within a single device.

Unique Advantages

• High Logic Capacity: 48,000 logic elements allow integration of complex state machines, datapaths, and control logic on‑chip.
• Substantial On‑Chip Memory: Approximately 4.25 Mbits of embedded RAM reduces dependence on external memory components.
• Extensive I/O Availability: 410 I/O pins provide flexibility for dense peripheral and sensor interfaces without external expanders.
• Industrial Temperature Range: Rated −40 °C to 100 °C for reliable operation in demanding environmental conditions.
• Compact, High‑Pin Package: 900‑BBGA (900‑FPBGA, 31×31) package packs high functionality into a board‑space‑efficient form factor.
• Low‑Voltage Operation: 1.14–1.26 V supply supports integration into modern low‑power system architectures.

Why Choose LFE2M50E-6F900I?

The LFE2M50E-6F900I positions itself as a versatile FPGA option for industrial embedded designs that require a combination of high programmable logic density, significant on‑chip memory, and a large number of I/O. Its industrial temperature rating and surface‑mount 900‑BBGA package make it suitable for compact, robust system implementations.

Engineers designing control systems, interface bridges, or custom accelerators will find the device's logic capacity, memory resources, and I/O count useful for consolidating multiple functions into a single programmable device while maintaining alignment with low‑voltage system requirements.

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