LFE2M35SE-6FN256C

The LFE2M35SE-6FN256C is a Field Programmable Gate Array (FPGA) offered in a 256-ball BGA package for commercial applications. It delivers a combination of reconfigurable logic capacity, on-chip memory, and a substantial I/O count for embedded designs that require flexible hardware implementation within a compact surface-mount package.

Key Features

• Core Capacity  Approximately 34,000 logic elements providing a high-density programmable fabric for custom logic implementations.
• On-chip Memory  Approximately 2.15 Mbits of embedded RAM to support local buffering, FIFOs, and state storage without external memory.
• I/O and Package  140 general-purpose I/O pins delivered in a 256-BGA / 256-FPBGA (17×17) package for high pin-count designs in a compact footprint.
• Power  Operates from a low-voltage supply range of 1.14 V to 1.26 V to match modern low-voltage system rails.
• Mounting and Grade  Surface-mount device rated for commercial temperature operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS-compliant, supporting lead-free manufacturing requirements.

Typical Applications

• Custom Logic and Hardware Acceleration  Deploys the 34,000 logic elements and on-chip RAM for application-specific processing and protocol acceleration.
• I/O-Heavy Embedded Systems  Leverages 140 I/O pins and the compact 256-BGA package for designs that require many external interfaces in a small board area.
• Prototyping and Commercial Product Designs  Surface-mount packaging and commercial temperature rating make it suitable for prototyping and production-class embedded products.

Unique Advantages

• High Logic Density:  About 34,000 logic elements enable sizable combinational and sequential logic implementations on a single device.
• Substantial Embedded Memory:  Approximately 2.15 Mbits of on-chip RAM reduces dependence on external memory for many designs.
• Ample I/O Availability:  140 I/Os simplify external interfacing and reduce the need for additional I/O-expander components.
• Compact BGA Footprint:  256-FPBGA (17×17) packaging balances pin count with board-area efficiency for space-constrained systems.
• Low-Voltage Supply Range:  Operates within a 1.14–1.26 V supply window to integrate with low-voltage system rails.
• RoHS Compliance:  Meets lead-free manufacturing requirements for environmentally conscious production processes.

Why Choose LFE2M35SE-6FN256C?

The LFE2M35SE-6FN256C positions itself as a capable commercial-grade FPGA option for designers needing a balance of logic density, on-chip memory, and high I/O count in a compact surface-mount BGA package. Its specifications make it well-suited for embedded systems, custom hardware functions, and I/O-rich designs where on-chip resources reduce external component count.

With a defined operating voltage range, commercial temperature rating, and RoHS compliance, this FPGA provides a verifiable platform for production deployments that require reconfigurable logic and local memory while maintaining compatibility with common low-voltage system architectures.

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