LFE2M35SE-6FN256I

IC FPGA 140 I/O 256FBGA
Part Description

ECP2M Field Programmable Gate Array (FPGA) IC 140 2151424 34000 256-BGA

Quantity 1,723 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BGANumber of I/O140Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4250Number of Logic Elements/Cells34000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits2151424

Overview of LFE2M35SE-6FN256I – ECP2M Field Programmable Gate Array (FPGA) IC, 140 I/Os, ~2.15 Mbits RAM, 34,000 Logic Elements, 256-BGA

The LFE2M35SE-6FN256I is an ECP2M family field programmable gate array (FPGA) from Lattice Semiconductor. It delivers mid-range programmable logic capacity with 34,000 logic elements and approximately 2.15 Mbits of embedded RAM in a compact 256-ball BGA package.

Engineered for industrial environments, this FPGA offers 140 I/O pins, a low-voltage core supply range (1.14 V to 1.26 V) and an operating temperature range of −40 °C to 100 °C, making it suitable for designs requiring reliable operation across extended temperature conditions.

Key Features

  • Core Logic 34,000 logic elements provide a mid-range programmable fabric for implementing custom digital logic and glue functions.
  • Embedded Memory Approximately 2.15 Mbits of on-chip RAM to support buffering, FIFOs, and small data stores without external memory.
  • I/O and Package 140 I/O pins in a 256-ball FPBGA (17 × 17) package enable a dense pinout for interface connectivity while maintaining a compact board footprint.
  • Power Core voltage supply range from 1.14 V to 1.26 V to match low-voltage system domains.
  • Temperature and Grade Industrial-grade device rated for operation from −40 °C to 100 °C for deployment in demanding environments.
  • Mounting and Compliance Surface-mount package with RoHS compliance for modern manufacturing and environmental requirements.

Unique Advantages

  • Balanced logic and memory capacity: Combines 34,000 logic elements with ~2.15 Mbits of embedded RAM for versatile mid-range designs.
  • Dense I/O in a compact package: 140 I/Os in a 256-BGA (17 × 17) footprint help reduce board area while supporting multiple interfaces.
  • Industrial temperature operation: −40 °C to 100 °C rating supports designs that must operate across wide thermal ranges.
  • Low-voltage core compatibility: 1.14 V to 1.26 V supply range aligns with modern low-voltage system domains.
  • Surface-mount, RoHS-compliant package: Supports standard SMT assembly processes and environmental compliance requirements.

Why Choose LFE2M35SE-6FN256I?

The LFE2M35SE-6FN256I positions itself as a reliable mid-density FPGA option for industrial applications that require a combination of substantial logic capacity, embedded RAM, and a high I/O count in a space-efficient package. Its industrial temperature rating and RoHS compliance make it suitable for long-term deployments where environmental durability matters.

This part is appropriate for engineering teams seeking a Lattice Semiconductor ECP2M-family device that balances integration and board-level footprint while operating within low-voltage domains. Its specification set supports designs that need deterministic on-chip resources without relying solely on external components.

Request a quote or submit a pricing and availability inquiry to begin procurement for LFE2M35SE-6FN256I.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1983


    Headquarters: Hillsboro, Oregon, USA


    Employees: 1,000+


    Revenue: $627.7 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up