LFE2M35SE-6FN256I
| Part Description |
ECP2M Field Programmable Gate Array (FPGA) IC 140 2151424 34000 256-BGA |
|---|---|
| Quantity | 1,723 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 140 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4250 | Number of Logic Elements/Cells | 34000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2151424 |
Overview of LFE2M35SE-6FN256I – ECP2M Field Programmable Gate Array (FPGA) IC, 140 I/Os, ~2.15 Mbits RAM, 34,000 Logic Elements, 256-BGA
The LFE2M35SE-6FN256I is an ECP2M family field programmable gate array (FPGA) from Lattice Semiconductor. It delivers mid-range programmable logic capacity with 34,000 logic elements and approximately 2.15 Mbits of embedded RAM in a compact 256-ball BGA package.
Engineered for industrial environments, this FPGA offers 140 I/O pins, a low-voltage core supply range (1.14 V to 1.26 V) and an operating temperature range of −40 °C to 100 °C, making it suitable for designs requiring reliable operation across extended temperature conditions.
Key Features
- Core Logic 34,000 logic elements provide a mid-range programmable fabric for implementing custom digital logic and glue functions.
- Embedded Memory Approximately 2.15 Mbits of on-chip RAM to support buffering, FIFOs, and small data stores without external memory.
- I/O and Package 140 I/O pins in a 256-ball FPBGA (17 × 17) package enable a dense pinout for interface connectivity while maintaining a compact board footprint.
- Power Core voltage supply range from 1.14 V to 1.26 V to match low-voltage system domains.
- Temperature and Grade Industrial-grade device rated for operation from −40 °C to 100 °C for deployment in demanding environments.
- Mounting and Compliance Surface-mount package with RoHS compliance for modern manufacturing and environmental requirements.
Unique Advantages
- Balanced logic and memory capacity: Combines 34,000 logic elements with ~2.15 Mbits of embedded RAM for versatile mid-range designs.
- Dense I/O in a compact package: 140 I/Os in a 256-BGA (17 × 17) footprint help reduce board area while supporting multiple interfaces.
- Industrial temperature operation: −40 °C to 100 °C rating supports designs that must operate across wide thermal ranges.
- Low-voltage core compatibility: 1.14 V to 1.26 V supply range aligns with modern low-voltage system domains.
- Surface-mount, RoHS-compliant package: Supports standard SMT assembly processes and environmental compliance requirements.
Why Choose LFE2M35SE-6FN256I?
The LFE2M35SE-6FN256I positions itself as a reliable mid-density FPGA option for industrial applications that require a combination of substantial logic capacity, embedded RAM, and a high I/O count in a space-efficient package. Its industrial temperature rating and RoHS compliance make it suitable for long-term deployments where environmental durability matters.
This part is appropriate for engineering teams seeking a Lattice Semiconductor ECP2M-family device that balances integration and board-level footprint while operating within low-voltage domains. Its specification set supports designs that need deterministic on-chip resources without relying solely on external components.
Request a quote or submit a pricing and availability inquiry to begin procurement for LFE2M35SE-6FN256I.

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