LFE2M35SE-5F672C
| Part Description |
ECP2M Field Programmable Gate Array (FPGA) IC 410 2151424 34000 672-BBGA |
|---|---|
| Quantity | 168 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FPBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 410 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4250 | Number of Logic Elements/Cells | 34000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2151424 |
Overview of LFE2M35SE-5F672C – ECP2M FPGA, 34,000 logic elements, 410 I/Os
The LFE2M35SE-5F672C is an ECP2M Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It provides a programmable logic fabric with a high I/O count and on-chip RAM to support complex digital integration in surface-mount applications.
Key on-chip resources include approximately 34,000 logic elements, about 2.15 Mbits of embedded memory, and 410 physical I/O pins, delivering a balance of logic capacity, memory, and connectivity for a wide range of electronic designs.
Key Features
- Logic Capacity Approximately 34,000 logic elements suitable for implementing substantial custom logic and control functions.
- Embedded Memory Approximately 2.15 Mbits of on-chip RAM to support buffering, packet storage, and intermediate data processing without external memory.
- I/O Count 410 I/O pins to accommodate dense parallel interfaces, multiple peripherals, and flexible board-level routing.
- Power Supply Core voltage range of 1.14 V to 1.26 V for defined power-domain integration and supply planning.
- Package & Mounting 672-ball BBGA package (672-FPBGA, 27 × 27 mm) in a surface-mount form factor for compact PCB footprint and automated assembly.
- Operating Grade & Temperature Commercial grade device rated for 0 °C to 85 °C operation.
- RoHS Compliance RoHS-compliant manufacturing to meet common environmental and regulatory requirements.
Unique Advantages
- High integration density: Large logic element count and substantial on-chip RAM reduce the need for external components and simplify board designs.
- Extensive connectivity: 410 I/Os enable direct interfacing to multiple peripherals and high-pin-count subsystems without external I/O expanders.
- Compact BBGA package: 672-ball FPBGA (27 × 27 mm) offers a space-efficient solution for densely populated PCBs while supporting automated surface-mount assembly.
- Defined power domain: Narrow core voltage range (1.14 V–1.26 V) supports predictable power budgeting and supply design.
- Commercial temperature rating: Rated for 0 °C to 85 °C operation to match typical commercial electronic product environments.
- Regulatory readiness: RoHS compliance helps meet environmental directives for modern electronic products.
Why Choose LFE2M35SE-5F672C?
The LFE2M35SE-5F672C positions itself as a mid-to-high-capacity FPGA option within the ECP2M family, offering a strong combination of logic resources, embedded memory, and I/O density in a compact BBGA package. Its defined voltage range, surface-mount package, and commercial temperature rating make it suitable for designs that require substantial programmable logic and high connectivity while adhering to standard manufacturing processes.
Backed by Lattice Semiconductor Corporation’s product documentation and family-level resources, this device is appropriate for development teams and procurement looking for a programmable, RoHS-compliant FPGA with clear hardware characteristics and predictable integration requirements.
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